Rogers RT/duroid 6035HTC PCB 2-Layer 1.6mm Thick
This 2-layer (double-sided) rigid PCB serves high-power RF and microwave applications. By utilizing Rogers RT/duroid 6035HTC, a ceramic-filled PTFE composite, it achieves excellent thermal management and signal integrity. Each construction aspect, from material choice to surface finish, is optimized for high-power operation, guaranteeing reliability in challenging scenarios such as amplifiers and power dividers. Key specifications are as follows:
1.PCB Specifications
| Parameter |
Details |
| Base Material |
Rogers RT/duroid 6035HTC (ceramic-filled PTFE composite for high-power RF/microwave use) |
| Layer Count |
Double-sided (2-layer rigid structure) |
| Board Dimensions |
77mm x 96mm per piece (1PCS), with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space |
5 mils (trace) / 9 mils (space) |
| Minimum Hole Size |
0.3mm |
| Vias |
No blind vias; via plating thickness = 20 μm (ensures low-resistance current flow) |
| Finished Board Thickness |
1.6mm |
| Finished Copper Weight |
1oz (1.4 mils) for both outer layers (Copper_layer_1 & Copper_layer_2) |
| Surface Finish |
Immersion Gold (delivers excellent solderability, corrosion resistance, and stable contact resistance for high-power connections) |
| Silkscreen |
Black silkscreen on top layer (for clear component labeling); no silkscreen on bottom layer |
| Solder Mask |
No solder mask on top or bottom layers |
| Quality Assurance |
100% electrical testing conducted prior to shipment (verifies functional integrity for high-power operation) |
2. PCB Stack-up Configuration
| Layer Name |
Material |
Thickness |
| Top Layer (Copper_layer_1) |
35 μm thick copper |
35 μm (1oz) |
| Substrate Layer |
Rogers RT/duroid 6035HTC |
1.524mm (60mil) |
| Bottom Layer (Copper_layer_2) |
35 μm thick copper |
35 μm (1oz) |
3. Quality & Global Compliance
Artwork Format: Gerber RS-274-X (the universal industry standard)
Quality Standard: IPC-Class-2 compliant (meets commercial/industrial reliability requirements for high-power systems)
Availability: Globally accessible, supporting timely production in markets worldwide.
4. Rogers RT/duroid 6035HTC Material Introduction
Rogers RT/duroid 6035HTC is a premium high-frequency circuit material tailored for high-power RF and microwave applications.
A standout attribute is its superior thermal conductivity—almost 2.4 times that of standard RT/duroid 6000-series materials—enabling efficient dissipation of heat generated by high-power components (e.g., amplifiers). It also features copper foil (ED and reverse treat) with excellent long-term thermal stability.
Additionally, its advanced filler system delivers excellent drillability, reducing manufacturing costs compared to high-thermal-conductivity laminates that use alumina fillers.
5. RT/duroid 6035HTC Key Features
The material’s features are engineered to excel in high-power environments, balancing thermal resilience with signal integrity:
| Feature |
Specification |
| Dielectric Constant (Dk) |
3.5 ± 0.05 at 10GHz/23°C |
| Dissipation Factor |
0.0013 at 10GHz/23°C |
| Thermal Coefficient of Dielectric Constant |
-66 ppm/°C |
| Moisture Absorption |
0.06% |
| Thermal Conductivity |
1.44 W/m/K at 80°C |
| Coefficient of Thermal Expansion (CTE) |
X-axis: 19 ppm/°C; Y-axis: 19 ppm/°C; Z-axis: 39 ppm/°C |
| Flammability Rating |
UL 94-V0 |
| Process Compatibility |
Lead-free process compatible |
6. Material Benefits
The use of RT/duroid 6035HTC translates to tangible advantages for high-power applications, addressing key pain points like overheating and signal loss:
-Superior Thermal Management: High thermal conductivity (1.44 W/m/K) and improved dielectric heat dissipation lower operating temperatures for high-power components, extending their lifespan and reducing performance degradation.
-Excellent High-Frequency Performance: Low dissipation factor (0.0013 at 10GHz) minimizes insertion loss, preserving signal strength even in high-power, high-frequency circuits (e.g., microwave amplifiers).
-Thermal Stability: Copper foil with long-term thermal stability and controlled CTE (matched to circuit requirements) prevents trace cracking or delamination under thermal cycling—critical for reliable high-power operation.
-Manufacturing Efficiency: Advanced filler system enables easy drillability, reducing production time and costs compared to other high-thermal-conductivity laminates.
-Safety & Compliance: UL 94-V0 flammability rating and lead-free compatibility meet global safety and environmental standards.
7. Typical Applications
This PCB is ideally suited for the following applications:
-High-Power RF/Microwave Amplifiers: Requires efficient heat dissipation and low signal loss to maintain output power and reliability.
-Power Management Components: Couplers, filters, and combiners—benefit from stable Dk and thermal conductivity to handle high-power signals without overheating.
-High-Power Dividers: Demands precise signal splitting and thermal stability to ensure uniform power distribution across channels.
-Industrial RF Systems: High-power transmitters or receivers (e.g., in telecommunications or radar)
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