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Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold

Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo + caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 PCS por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-470.V1.0
Material Básico:
RO3010, espessura de 0,254 mm
Contagem de camadas:
2 camadas
Espessura da PCB:
10mil
Tamanho da placa de circuito impresso:
65 mm × 57 mm (1 unidade)
Máscara de solda:
Não
Serigrafia:
Preto
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Imersão Ouro
Destacar:

Double-Sided RO3010 PCB

,

10mil laminate PCB

,

Immersion gold Rogers PCB

Descrição do produto

This double-sided PCB is specifically tailored for high-frequency microwave and RF applications, with RO3010 serving as its core substrate material. As a ceramic-filled PTFE composite, RO3010 inherently ensures superior electrical stability, low signal loss, and reliable operational performance, which are critical for meeting the stringent requirements of high-frequency signal transmission and processing in related electronic systems.

 

PCB Details

Specification Item Details
Board Type Double-sided PCB
Substrate Material RO3010, 0.254mm thickness
Copper Thickness 1oz finished copper
Surface Treatment No solder mask, black silkscreen; Immersion gold finish
Dimension 65mm × 57mm (1PCS)

 

Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold 0

 

RO3010 Introduction

RO3010 is a member of the RO3000® series high-frequency circuit materials, which are ceramic-filled PTFE (Polytetrafluoroethylene) composites specifically developed for commercial microwave and RF (Radio Frequency) applications. The RO3000 series is designed to provide exceptional electrical and mechanical stability at competitive prices, making it a cost-effective choice for high-frequency circuit design.

 

As a ceramic-filled PTFE-based circuit material, RO3010 has consistent mechanical properties regardless of the dielectric constant selected. This unique characteristic allows designers to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability issues during processing and application.

 

RO3010 exhibits excellent dimensional stability, with a coefficient of thermal expansion (CTE) in the X and Y axes that matches that of copper, ensuring minimal dimensional changes even under temperature fluctuations. Additionally, it features outstanding plated through-hole reliability, even in severe thermal environments, thanks to its stable Z-axis CTE. The material can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with only minor modifications required as described in the application note “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.”

 

RO3010 Typical Values

Property RO3010 Typical Value Direction Units Condition Test Method
Dielectric Constant, εProcess 10.2±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εDesign 11.2 Z - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor, tanδ 0.0022 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35; 0.31 X; Y mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 10⁵ - MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 10⁵ - COND A IPC 2.5.17.1
Tensile Modulus 1902; 1934 X; Y MPa 23℃ ASTM D 638
Moisture Absorption 0.05 - % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 - j/g/k - Calculated
Thermal Conductivity 0.95 - W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃) 13; 11; 16 X; Y; Z ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 - ℃ TGA - ASTM D 3850
Density 2.8 - gm/cm³ 23℃ ASTM D 792
Copper Peel Strength 9.4 - Ib/in. 1oz, EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 - - - UL 94
Lead-free Process Compatible Yes - - - -

 

RO3010 Application Fields

Benefiting from its excellent electrical performance, mechanical stability, and cost-effectiveness, RO3010 is widely used in commercial microwave and RF applications, where high signal integrity and dimensional stability are critical. Its main application fields include:

 

-Microwave Communication Equipment: Used in microwave transceivers, power amplifiers, and microwave filters, where its low dissipation factor and stable dielectric constant ensure minimal signal loss and reliable performance.

 

-RF Communication Systems: Applied in RF antennas, radar systems, and satellite communication equipment, leveraging its excellent dimensional stability and thermal performance to adapt to complex environmental conditions.

 

-High-Frequency Test Equipment: Used in test probes, signal generators, and spectrum analyzers, where precise electrical parameters are required to ensure accurate test results.

 

-Consumer Electronics: Integrated into high-frequency modules of advanced consumer electronics, such as 5G communication devices, to support high-speed signal transmission.

 

-Industrial and Medical Electronics: Used in industrial control systems and medical diagnostic equipment that require high-frequency signal processing, thanks to its reliable performance and lead-free compatibility.

 

In summary, RO3010 is a high-performance, cost-effective high-frequency circuit material that meets the requirements of various commercial microwave and RF applications, providing designers with a flexible and reliable solution for circuit design.

 

Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold 1

produtos
Detalhes dos produtos
Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo + caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 PCS por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-470.V1.0
Material Básico:
RO3010, espessura de 0,254 mm
Contagem de camadas:
2 camadas
Espessura da PCB:
10mil
Tamanho da placa de circuito impresso:
65 mm × 57 mm (1 unidade)
Máscara de solda:
Não
Serigrafia:
Preto
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Imersão Ouro
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo + caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000 PCS por mês
Destacar

Double-Sided RO3010 PCB

,

10mil laminate PCB

,

Immersion gold Rogers PCB

Descrição do produto

This double-sided PCB is specifically tailored for high-frequency microwave and RF applications, with RO3010 serving as its core substrate material. As a ceramic-filled PTFE composite, RO3010 inherently ensures superior electrical stability, low signal loss, and reliable operational performance, which are critical for meeting the stringent requirements of high-frequency signal transmission and processing in related electronic systems.

 

PCB Details

Specification Item Details
Board Type Double-sided PCB
Substrate Material RO3010, 0.254mm thickness
Copper Thickness 1oz finished copper
Surface Treatment No solder mask, black silkscreen; Immersion gold finish
Dimension 65mm × 57mm (1PCS)

 

Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold 0

 

RO3010 Introduction

RO3010 is a member of the RO3000® series high-frequency circuit materials, which are ceramic-filled PTFE (Polytetrafluoroethylene) composites specifically developed for commercial microwave and RF (Radio Frequency) applications. The RO3000 series is designed to provide exceptional electrical and mechanical stability at competitive prices, making it a cost-effective choice for high-frequency circuit design.

 

As a ceramic-filled PTFE-based circuit material, RO3010 has consistent mechanical properties regardless of the dielectric constant selected. This unique characteristic allows designers to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability issues during processing and application.

 

RO3010 exhibits excellent dimensional stability, with a coefficient of thermal expansion (CTE) in the X and Y axes that matches that of copper, ensuring minimal dimensional changes even under temperature fluctuations. Additionally, it features outstanding plated through-hole reliability, even in severe thermal environments, thanks to its stable Z-axis CTE. The material can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, with only minor modifications required as described in the application note “Fabrication Guidelines for RO3000 Series High Frequency Circuit Materials.”

 

RO3010 Typical Values

Property RO3010 Typical Value Direction Units Condition Test Method
Dielectric Constant, εProcess 10.2±0.05 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εDesign 11.2 Z - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor, tanδ 0.0022 Z - 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35; 0.31 X; Y mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 10⁵ - MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 10⁵ - COND A IPC 2.5.17.1
Tensile Modulus 1902; 1934 X; Y MPa 23℃ ASTM D 638
Moisture Absorption 0.05 - % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 - j/g/k - Calculated
Thermal Conductivity 0.95 - W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃) 13; 11; 16 X; Y; Z ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 - ℃ TGA - ASTM D 3850
Density 2.8 - gm/cm³ 23℃ ASTM D 792
Copper Peel Strength 9.4 - Ib/in. 1oz, EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 - - - UL 94
Lead-free Process Compatible Yes - - - -

 

RO3010 Application Fields

Benefiting from its excellent electrical performance, mechanical stability, and cost-effectiveness, RO3010 is widely used in commercial microwave and RF applications, where high signal integrity and dimensional stability are critical. Its main application fields include:

 

-Microwave Communication Equipment: Used in microwave transceivers, power amplifiers, and microwave filters, where its low dissipation factor and stable dielectric constant ensure minimal signal loss and reliable performance.

 

-RF Communication Systems: Applied in RF antennas, radar systems, and satellite communication equipment, leveraging its excellent dimensional stability and thermal performance to adapt to complex environmental conditions.

 

-High-Frequency Test Equipment: Used in test probes, signal generators, and spectrum analyzers, where precise electrical parameters are required to ensure accurate test results.

 

-Consumer Electronics: Integrated into high-frequency modules of advanced consumer electronics, such as 5G communication devices, to support high-speed signal transmission.

 

-Industrial and Medical Electronics: Used in industrial control systems and medical diagnostic equipment that require high-frequency signal processing, thanks to its reliable performance and lead-free compatibility.

 

In summary, RO3010 is a high-performance, cost-effective high-frequency circuit material that meets the requirements of various commercial microwave and RF applications, providing designers with a flexible and reliable solution for circuit design.

 

Double-Sided RO3010 PCB on 10mil Laminate with Immersion Gold 1

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