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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

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PWB do núcleo do metal

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6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000pcs por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Material base:

RO4350B + FR-4 (S1000-2M) de alta Tg

Contagem de camadas:

6 Camadas

Espessura da PCB:

1,3 mm

Tamanho da placa de circuito impresso:

30,55 mm x 37,7 mm (1 peça) com tolerância de ± 0,15 mm

Silkscreen:

Branco

Máscara de solda:

Verde

Peso de cobre:

1 onça (1,4 mils) para camadas internas/externas

Acabamento de superfície:

Ouro de imersão em paládio sem eletrodo de níquel (ENEPIG)

Destacar:

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Descrição do produto

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.

Rogers RO4350B Material Overview

Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.

Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss--all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Tags:

produtos

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000pcs por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Material base:

RO4350B + FR-4 (S1000-2M) de alta Tg

Contagem de camadas:

6 Camadas

Espessura da PCB:

1,3 mm

Tamanho da placa de circuito impresso:

30,55 mm x 37,7 mm (1 peça) com tolerância de ± 0,15 mm

Silkscreen:

Branco

Máscara de solda:

Verde

Peso de cobre:

1 onça (1,4 mils) para camadas internas/externas

Acabamento de superfície:

Ouro de imersão em paládio sem eletrodo de níquel (ENEPIG)

Quantidade de ordem mínima:

1 unidade

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo+caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T

Habilidade da fonte:

5000pcs por mês

Destacar

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Descrição do produto

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.

PCB Specification

Construction Parameter	Specification
Base Material	RO4350B + High Tg FR-4 (S1000-2M)
Layer Count	6-layer
Board Dimensions	30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm
Minimum Trace/Space	4 mils / 4 mils
Minimum Hole Size	0.25mm
Vias (Special Types)	Blind vias (L1-L2)
Finished Board Thickness	1.3mm
Finished Copper Weight (Inner/Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	No
Bottom Solder Mask	Green
Quality Assurance (Electrical Testing)	100% Electrical test performed prior to shipment

Hybrid PCB Stack-up

Layer Sequence	Layer Type	Specification	Thickness
1	Copper Layer (Top)	Copper_layer_1	35 μm
2	Laminate	RO4350B	0.102mm (4mil)
3	Copper Layer	Copper_layer_2	35 μm
4	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
5	Copper Layer	Copper_layer_3	35 μm
6	Core Material	S1000-2M	0.254mm (10mil)
7	Copper Layer	Copper_layer_4	35 μm
8	Prepreg	1080 RC63% + 7628 (43%)	0.254mm (10mil)
9	Copper Layer	Copper_layer_5	35 μm
10	Core Material	S1000-2M	0.254mm (10mil)
11	Copper Layer (Bottom)	Copper_layer_6	35 μm

What is a Hybrid PCB?

Rogers RO4350B Material Overview

RO4350B Properties

Property	Specification
Material Type	Proprietary woven glass reinforced hydrocarbon/ceramic laminate
Dielectric Constant (Dk)	3.48 ±0.05 (measured at 10GHz/23°C)
Dissipation Factor (Df)	0.0037 (measured at 10GHz/23°C)
Thermal Conductivity	0.69 W/m/°K
Coefficient of Thermal Expansion (CTE)	X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C
Glass Transition Temperature (Tg)	>280°C (536°F)
Moisture Absorption	0.06% (max)
Flammability Rating	UL 94 V-0

Core Features (S1000-2M High Tg FR-4)

Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
Superior mechanical processability paired with exceptional thermal resistance
Lead-free soldering compatibility, aligning with modern manufacturing standards
Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
Outstanding high-heat endurance for stable performance in elevated temperature conditions
Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
Minimal moisture absorption, ensuring durability in humid operating environments

Typical Applications

Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Systems
Radar & Guidance Systems
Point-to-Point Digital Radio Antennas

Tags:

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Multi PWB da camada 2OZ,

4 camadas de placa de circuito Multilayer,

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

6-layer hybrid PCB RO4350B

high Tg FR-4 PCB

blind vias multilayer PCB

Multi PWB da camada 2OZ,

4 camadas de placa de circuito Multilayer,