| MOQ: | 1 unidade |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T |
| Capacidade de abastecimento: | 5000 unidades por mês |
This 2-layer rigid PCB adopts Rogers RO4003C, a proprietary woven glass-reinforced hydrocarbon/ceramic composite material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO4003C |
| Board Dimensions | 54mm × 58mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; Total vias: 19; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Silver |
| Silkscreen | Black silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO4003C Core | 0.203mm (8 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO4003C Material Introduction
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics, integrating the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification.
RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C materials are non-brominated and are not UL 94 V-0 rated. With a Tg of >280°C, their expansion characteristics remain stable over the entire range of circuit processing temperatures.
![]()
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO4003C proprietary woven glass reinforced hydrocarbon/ceramics |
| Dielectric Constant (Dk) | 3.38 ± 0.05 at 10 GHz |
| Dissipation Factor | 0.0027 at 10 GHz; 0.0021 at 2.5 GHz |
| Thermal Coefficient of Dielectric Constant | +40 ppm/°C |
| Thermal Conductivity | 0.71 W/m·°K |
| Moisture Absorption | 0.06% |
| Coefficient of Thermal Expansion (CTE) | X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 46 ppm/°C |
| Surface Finish Advantage | Immersion silver ensures excellent solderability and corrosion resistance |
Core Benefits
Suitable for Multi-Layer Constructions: Ideal for MLB designs; copper-matched CTE ensures excellent dimensional stability in mixed dielectric multilayers.
Cost-Effective Manufacturability: FR-4 process-compatible, no special through-hole treatment, lower fabrication cost than conventional microwave laminates.
High-Performance for Volume Applications: Designed for high-volume, performance-sensitive RF applications, balancing electrical performance and production efficiency.
Competitive Pricing: Superior electrical performance at a fraction of conventional microwave laminate cost, excellent cost-performance ratio.
Reliable Plated Through-Hole Quality: Low Z-axis CTE ensures reliable plated through-holes even under severe thermal shock.
Stable Thermal Performance: Tg >280°C maintains stable expansion during all circuit processing temperatures.
Low Environmental Sensitivity: 0.06% moisture absorption minimizes performance degradation in humid environments.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.
Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Cellular Base Station Antennas and Power Amplifiers
-RF Identification Tags
-Automotive Radar and Sensors
-LNB's for Direct Broadcast Satellites
Summary
This 2-layer rigid PCB based on Rogers RO4003C substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications. With its competitive pricing and global supply capability, It serves as a trustworthy option for high-volume production of precision RF devices.
![]()
| MOQ: | 1 unidade |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T |
| Capacidade de abastecimento: | 5000 unidades por mês |
This 2-layer rigid PCB adopts Rogers RO4003C, a proprietary woven glass-reinforced hydrocarbon/ceramic composite material that integrates the electrical performance of PTFE/woven glass laminates with the manufacturability of epoxy/glass substrates. It is engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios.
PCB Specifications
| Parameter | Details |
| Layer Count | 2-Layer (rigid structure) |
| Base Material | Rogers RO4003C |
| Board Dimensions | 54mm × 58mm per piece (1PCS), tolerance ±0.15mm |
| Minimum Trace/Space | 4 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.2mm |
| Vias | No blind vias; Total vias: 19; Via plating thickness: 20 μm |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Silver |
| Silkscreen | Black silkscreen on top layer; No silkscreen on bottom layer |
| Solder Mask | No solder mask on top layer; No solder mask on bottom layer |
| Quality Assurance | 100% electrical test conducted prior to shipment |
PCB Stack-up
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | Rogers RO4003C Core | 0.203mm (8 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
Rogers RO4003C Material Introduction
Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics, integrating the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. Offered in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, with all configurations meeting the same laminate electrical performance specification.
RO4003C laminates provide tight control on dielectric constant (Dk) and low loss while utilizing the same processing method as standard epoxy/glass but at a fraction of the cost of conventional microwave laminates. Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C materials are non-brominated and are not UL 94 V-0 rated. With a Tg of >280°C, their expansion characteristics remain stable over the entire range of circuit processing temperatures.
![]()
Key Material Features
| Feature | Specification/Description |
| Material Composition | Rogers RO4003C proprietary woven glass reinforced hydrocarbon/ceramics |
| Dielectric Constant (Dk) | 3.38 ± 0.05 at 10 GHz |
| Dissipation Factor | 0.0027 at 10 GHz; 0.0021 at 2.5 GHz |
| Thermal Coefficient of Dielectric Constant | +40 ppm/°C |
| Thermal Conductivity | 0.71 W/m·°K |
| Moisture Absorption | 0.06% |
| Coefficient of Thermal Expansion (CTE) | X axis: 11 ppm/°C; Y axis: 14 ppm/°C; Z axis: 46 ppm/°C |
| Surface Finish Advantage | Immersion silver ensures excellent solderability and corrosion resistance |
Core Benefits
Suitable for Multi-Layer Constructions: Ideal for MLB designs; copper-matched CTE ensures excellent dimensional stability in mixed dielectric multilayers.
Cost-Effective Manufacturability: FR-4 process-compatible, no special through-hole treatment, lower fabrication cost than conventional microwave laminates.
High-Performance for Volume Applications: Designed for high-volume, performance-sensitive RF applications, balancing electrical performance and production efficiency.
Competitive Pricing: Superior electrical performance at a fraction of conventional microwave laminate cost, excellent cost-performance ratio.
Reliable Plated Through-Hole Quality: Low Z-axis CTE ensures reliable plated through-holes even under severe thermal shock.
Stable Thermal Performance: Tg >280°C maintains stable expansion during all circuit processing temperatures.
Low Environmental Sensitivity: 0.06% moisture absorption minimizes performance degradation in humid environments.
Quality Standard & Availability
Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.
Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.
Typical Applications
-Cellular Base Station Antennas and Power Amplifiers
-RF Identification Tags
-Automotive Radar and Sensors
-LNB's for Direct Broadcast Satellites
Summary
This 2-layer rigid PCB based on Rogers RO4003C substrate is a high-performance, cost-effective solution tailored for commercial microwave and RF applications. With its competitive pricing and global supply capability, It serves as a trustworthy option for high-volume production of precision RF devices.
![]()