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Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish

Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 unidades por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material Básico:
Rogers RO4533
Contagem de camadas:
2 camadas
Espessura da PCB:
0,8 mm
Tamanho da placa de circuito impresso:
46,95 mm × 53,13 mm
Silkscreen:
branco
Máscara de solda:
verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Níquel sem eléctroPalladio sem eléctro e ouro por imersão (ENEPIG)
Destacar:

Rogers RO4533 PCB ENEPIG Finish

,

2 Layer Rogers RO4533 PCB

,

0.8mm Rogers RO4533 PCB

Descrição do produto

This 2-layer rigid PCB adopts Rogers RO4533, a ceramic-filled, glass-reinforced hydrocarbon-based material. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for mobile infrastructure microstrip antenna applications.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4533
Board Dimensions 46.95mm × 53.13mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 4 mils (trace) / 5 mils (space)
Minimum Hole Size 0.4mm
Vias No blind vias; Total vias: 19; Via plating thickness: 20 μm
Finished Board Thickness 0.8mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen White silkscreen on top layer; No silkscreen on bottom layer
Solder Mask Green solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4533 Core 0.762mm (30 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4533 Material Introduction

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.

 

These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.

 

Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4533 ceramic-filled, glass-reinforced hydrocarbon based material
Dielectric Constant (Dk) 3.3 at 10 GHz
Dissipation Factor 0.0025 at 10 GHz
Coefficient of Thermal Expansion (CTE) X axis: 13 ppm/°C; Y axis: 11 ppm/°C; Z axis: 37 ppm/°C
Glass Transition Temperature (Tg) >280 °C
Moisture Absorption 0.02%
Thermal Conductivity 0.6 W/mk
Surface Finish Advantage ENEPIG ensures excellent solderability, corrosion resistance and reliable bonding performance

 

Core Benefits

Superior RF Performance: Low loss, low Dk and excellent passive intermodulation (PIM) response, suitable for a wide range of RF applications.

 

Excellent Process Compatibility: Thermoset resin system compatible with standard PCB fabrication processes, no special treatment for plated through-hole preparation.

 

Excellent Dimensional Stability: Ensures higher yield on larger panel sizes, maintaining structural integrity during manufacturing and handling.

 

Uniform Mechanical Properties: Maintains mechanical form during handling, enhancing process reliability.

 

Enhanced Power Handling: High thermal conductivity improves heat dissipation efficiency, supporting better power handling capability.

 

Cost-Effective Solution: Affordable alternative to conventional PTFE antenna technologies, optimizing price-performance ratio.

 

Environmentally Friendly: Halogen-free option available, meeting stringent "green" standards.

 

Low Environmental Sensitivity: 0.02% moisture absorption minimizes performance degradation in humid environments.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Cellular infrastructure base station antennas

-WiMAX antenna networks

 

Summary

By leveraging RO4533's superior electrical properties (low loss, low Dk, excellent PIM response), standard PCB process compatibility, this PCB serves as a trustworthy option for high-volume production of precision RF devices.

 

Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish 1

produtos
Detalhes dos produtos
Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 unidades por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material Básico:
Rogers RO4533
Contagem de camadas:
2 camadas
Espessura da PCB:
0,8 mm
Tamanho da placa de circuito impresso:
46,95 mm × 53,13 mm
Silkscreen:
branco
Máscara de solda:
verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Níquel sem eléctroPalladio sem eléctro e ouro por imersão (ENEPIG)
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo+caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000 unidades por mês
Destacar

Rogers RO4533 PCB ENEPIG Finish

,

2 Layer Rogers RO4533 PCB

,

0.8mm Rogers RO4533 PCB

Descrição do produto

This 2-layer rigid PCB adopts Rogers RO4533, a ceramic-filled, glass-reinforced hydrocarbon-based material. It is specifically engineered to reliably meet the stringent requirements for high-frequency signal transmission in precision RF application scenarios, particularly suitable for mobile infrastructure microstrip antenna applications.

 

PCB Specifications

Parameter Details
Layer Count 2-Layer (rigid structure)
Base Material Rogers RO4533
Board Dimensions 46.95mm × 53.13mm per piece (1PCS), tolerance ±0.15mm
Minimum Trace/Space 4 mils (trace) / 5 mils (space)
Minimum Hole Size 0.4mm
Vias No blind vias; Total vias: 19; Via plating thickness: 20 μm
Finished Board Thickness 0.8mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen White silkscreen on top layer; No silkscreen on bottom layer
Solder Mask Green solder mask on top layer; No solder mask on bottom layer
Quality Assurance 100% electrical test conducted prior to shipment

 

PCB Stack-up

Layer Name Material Thickness
Top Copper Layer (Copper_layer_1) Copper 35 μm
Substrate Core Rogers RO4533 Core 0.762mm (30 mil)
Bottom Copper Layer (Copper_layer_2) Copper 35 μm

 

Rogers RO4533 Material Introduction

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing.

 

These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.

 

Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish 0

 

Key Material Features

Feature Specification/Description
Material Composition Rogers RO4533 ceramic-filled, glass-reinforced hydrocarbon based material
Dielectric Constant (Dk) 3.3 at 10 GHz
Dissipation Factor 0.0025 at 10 GHz
Coefficient of Thermal Expansion (CTE) X axis: 13 ppm/°C; Y axis: 11 ppm/°C; Z axis: 37 ppm/°C
Glass Transition Temperature (Tg) >280 °C
Moisture Absorption 0.02%
Thermal Conductivity 0.6 W/mk
Surface Finish Advantage ENEPIG ensures excellent solderability, corrosion resistance and reliable bonding performance

 

Core Benefits

Superior RF Performance: Low loss, low Dk and excellent passive intermodulation (PIM) response, suitable for a wide range of RF applications.

 

Excellent Process Compatibility: Thermoset resin system compatible with standard PCB fabrication processes, no special treatment for plated through-hole preparation.

 

Excellent Dimensional Stability: Ensures higher yield on larger panel sizes, maintaining structural integrity during manufacturing and handling.

 

Uniform Mechanical Properties: Maintains mechanical form during handling, enhancing process reliability.

 

Enhanced Power Handling: High thermal conductivity improves heat dissipation efficiency, supporting better power handling capability.

 

Cost-Effective Solution: Affordable alternative to conventional PTFE antenna technologies, optimizing price-performance ratio.

 

Environmentally Friendly: Halogen-free option available, meeting stringent "green" standards.

 

Low Environmental Sensitivity: 0.02% moisture absorption minimizes performance degradation in humid environments.

 

Quality Standard & Availability

Quality Standard: Complies with IPC-Class-2, ensuring consistent quality via rigorous process control and 100% electrical verification before shipment.

 

Availability: Globally available, enabling timely delivery and efficient after-sales support for international customers.

 

Typical Applications

-Cellular infrastructure base station antennas

-WiMAX antenna networks

 

Summary

By leveraging RO4533's superior electrical properties (low loss, low Dk, excellent PIM response), standard PCB process compatibility, this PCB serves as a trustworthy option for high-volume production of precision RF devices.

 

Rogers RO4533 PCB 0.8mm 2-Layer ENEPIG Finish 1

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