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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

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PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

TLY-3

Espessura do laminado:

0,0035 polegadas; 0,0050 polegadas; 0,0075 polegadas; 0,0100 polegadas

Tamanho do laminado:

12 x 18 polegadas (305 x 457 mm); 16 x 36 polegadas (406 x 914 mm); 16 x 18 polegadas (406 x 457 mm)

Peso de cobre:

1/2 onça. Cobre ED ； 1 onça. CL1 cobre ； 1 onça. C1 cobre

Destacar:

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Descrição do produto

TLY-3 laminates are fabricated using ultra-lightweight woven fiberglass, offering significantly greater dimensional stability compared to chopped fiber-reinforced PTFE composites. The woven fiberglass matrix delivers a mechanically robust laminate ideal for high-volume production. Featuring an extremely low dissipation factor, TLY-3 performs reliably in 77 GHz automotive radar systems and other millimeter-wave antenna designs.

Comparative OEM testing at 77 GHz between low-reinforcement TLY-3 and its nearest chopped fiber-reinforced competitor demonstrated comparable “drop-in” insertion loss and dielectric performance, with the key advantage of drastically improved manufacturing yields. The dielectric constant (Dk) ranges from 2.17 to 2.40. For most thicknesses, Dk can be specified at any value within this range with a tight tolerance of ±0.02. At 10 GHz, the typical dissipation factor (Df) in the low-Dk region is approximately 0.0009.

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags:

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Laminados revestidos de cobre

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

TLY-3

Espessura do laminado:

0,0035 polegadas; 0,0050 polegadas; 0,0075 polegadas; 0,0100 polegadas

Tamanho do laminado:

12 x 18 polegadas (305 x 457 mm); 16 x 36 polegadas (406 x 914 mm); 16 x 18 polegadas (406 x 457 mm)

Peso de cobre:

1/2 onça. Cobre ED ； 1 onça. CL1 cobre ； 1 onça. C1 cobre

Quantidade de ordem mínima:

1 unidade

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo + caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T

Habilidade da fonte:

5000 PCS por mês

Destacar

PCB material TLY-3 laminate

high frequency copper clad sheet

TLY-3 copper clad laminate

Descrição do produto

Typical applications include satellite communications, automotive radar, filters, couplers, avionics, and phased-array antennas.

PCB Material TLY-3 High Frequency Laminates Copper Clad Sheet 0

Properties	Conditions	Typical Value	Unit	Test Method
Electrical Properties	Dielectric Constant @ 10 GHz	2.33 ± 0.02	-	IPC-650 2.5.5.5
	Dissipation Factor @ 10 GHz	0.0012	-	IPC-650 2.5.5.5
	Volume Resistivity (after elevated temp.)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Volume Resistivity (after humidity)	10¹⁰	Mohms/cm	IPC-650 2.5.17.1
	Surface Resistivity (after elevated temp.)	10⁸	Mohms	IPC-650 2.5.17.1
	Surface Resistivity (after humidity)	10⁸	Mohms	IPC-650 2.5.17.1
Thermal Properties	Thermal Conductivity	0.22	W/M*K	ASTM F 433
	CTE (25-260°C) - X	26	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Y	15	ppm/°C	ASTM D 3386 (TMA)
	CTE (25-260°C) - Z	217	ppm/°C	ASTM D 3386 (TMA)
Mechanical Properties	Peel Strength - 1/2 oz. ED copper	1.96 (11)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. CL1 copper	2.86 (16)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength - 1 oz. C1 copper	3.04 (17)	N/mm (Ibs/in)	IPC-650 2.4.8
	Peel Strength (at elevated temp.)	2.32 (13)	N/mm (Ibs/in)	IPC-650 2.4.8
	Flexural Strength - MD	96.91 (14,057)	N/mm² (psi)	IPC-650 2.4.4
	Flexural Strength - CD	89.32 (12,955)	N/mm² (psi)	IPC-650 2.4.4
	Young’s Modulus - MD	9.65 X 10³ (1.4 X 10⁶)	N/mm² (psi)	ASTM D 3039 / IPC-650 2.4.19
	Poisson’s Ratio - MD	0.21	-	ASTM D 3039 / IPC-650 2.4.19
Mechanical Properties	Density Specific Gravity	2.19	g/cm³	ASTM D 792
Mechanical Properties	Dimensional Stability - MD, 10 mil	-0.038	mm/M (mils/in)	IPC-650 2.4.39
Mechanical Properties	Dimensional Stability - CD, 10 mil (avg. after bake & thermal stress)	-0.038	mm/M (mils/in)	-
Chemical / Physical Properties	Moisture Absorption	0.02	%	IPC-650 2.6.2.1
	NASA Outgassing - TML	0.01	%	-
	NASA Outgassing - CVCM	0.01	%	-
	NASA Outgassing - WVR	0.01	%	-
	UL-94 Flammability Rating	V-0	-	UL-94

Key Benefits

Excellent dimensional stability
Ultra-low dissipation factor (Df)
High peel strength
Low moisture absorption
Consistent, uniform dielectric constant (Dk)
Laser-ablatable

Target Applications

Automotive radar
Satellite and cellular communications
Power amplifiers
LNBs, LNAs, and LNCs
Aerospace systems
Ka-band, E-band, and W-band applications

Tags: