Detalhes dos produtos

Para casa > produtos >

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

produtos

Laminados revestidos de cobre

Contacte-nos

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contacte agora

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

Duróide RT 6202

Espessura do laminado:

0,005” (0,127 mm) +/- 0,0005” 0,020” (0,508 mm) +/- 0,0010” 0,030” (0,762 mm) +/- 0,0010”

Tamanho do laminado:

12"X 18"(305mm X 457mm) 24"X 18"(610mm X 457mm)

Peso de cobre:

Folha de cobre eletrodepositada ½ onça. (18 µm) HH/HH 1 onça. (35 µm) Folha de cobre laminada H1/H1

Destacar:

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Descrição do produto

RT/duroid 6202 is a high-frequency circuit material formulated as a low-loss, low-dielectric-constant laminate. It delivers superior electrical and mechanical properties essential for designing complex microwave structures that require both mechanical reliability and electrical stability.

The inclusion of limited woven glass reinforcement provides excellent dimensional stability (0.05 to 0.07 mils/inch), which often eliminates the need for double etching to achieve tight positional tolerances.

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Ensures excellent high-frequency performance
Tight εr and Thickness Control: Provides consistent electrical characteristics
Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
Very Low Etch Shrinkage: Improves precision in circuit fabrication

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

Property Dielectric Constant ε r	Typical Value 2.94 ± 0.04 [3]	Direction Z	Units -	Conditions 10GHz/23°C	Test Method IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ	0.0015	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+5	Z	ppm/°C	10 GHz -50 to +150°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	106	Z	Mohm cm	A	ASTM D257
Surface Resistivity	109	Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)	X, Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	30 (4.3)	X, Y	MPs (kpsi)
Ultimate Strain	4.9	X, Y	%
Compressive Modulus	1035 (150)	Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.04	-	%	D23/24 D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Thermal Conductivity	0.68	-	W/m/K	80°C	ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C)	15 15 30	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Dimensional Stability	0.07	X, Y	mm/m (mil/inch)	after etch +E/150	IPC-TM-650, 2.4.3.9
Td	500		°CTGA		ASTM D3850
Density	2.1		gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)	-	J/g/K (BTU/lb/°F)	-	Calculated
Copper Peel	9.1 (1.6)		lbs/in (N/mm)		IPC-TM-650 2.4.8
Flammability	V-O				UL 94
Lead-Free Process Com- patible	YES

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 1

Tags:

Laminado revestido de cobre de 0,

1 mm,

produtos

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

Duróide RT 6202

Espessura do laminado:

0,005” (0,127 mm) +/- 0,0005” 0,020” (0,508 mm) +/- 0,0010” 0,030” (0,762 mm) +/- 0,0010”

Tamanho do laminado:

12"X 18"(305mm X 457mm) 24"X 18"(610mm X 457mm)

Peso de cobre:

Folha de cobre eletrodepositada ½ onça. (18 µm) HH/HH 1 onça. (35 µm) Folha de cobre laminada H1/H1

Quantidade de ordem mínima:

1 unidade

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo + caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T

Habilidade da fonte:

5000 PCS por mês

Destacar

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Descrição do produto

Cladding Options and Dielectric Thicknesses

Both electrodeposited and rolled copper foil cladding, ranging from ½ oz. to 2 oz./ft.², are available on dielectric thicknesses spanning 0.005" to 0.060" (0.127 to 1.524 mm).

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Ensures excellent high-frequency performance
Tight εr and Thickness Control: Provides consistent electrical characteristics
Excellent Electrical and Mechanical Properties: Enables reliable circuit construction
Extremely Low Thermal Coefficient of Dielectric Constant: Maintains electrical stability across temperature variations
In-Plane Expansion Coefficient Matched to Copper: Enhances reliability for surface-mounted assemblies and plated through-holes
Very Low Etch Shrinkage: Improves precision in circuit fabrication

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multilayer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

Property Dielectric Constant ε r	Typical Value 2.94 ± 0.04 [3]	Direction Z	Units -	Conditions 10GHz/23°C	Test Method IPC-TM-650, 2.5.5.5
Dissipation Factor, TAN δ	0.0015	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+5	Z	ppm/°C	10 GHz -50 to +150°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	106	Z	Mohm cm	A	ASTM D257
Surface Resistivity	109	Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)	X, Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	30 (4.3)	X, Y	MPs (kpsi)
Ultimate Strain	4.9	X, Y	%
Compressive Modulus	1035 (150)	Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.04	-	%	D23/24 D48/50	IPC-TM-650, 2.6.2.1 ASTM D570
Thermal Conductivity	0.68	-	W/m/K	80°C	ASTM C518
Coefficient of Thermal Expansion (-55 to 288 °C)	15 15 30	X Y Z	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
Dimensional Stability	0.07	X, Y	mm/m (mil/inch)	after etch +E/150	IPC-TM-650, 2.4.3.9
Td	500		°CTGA		ASTM D3850
Density	2.1		gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)	-	J/g/K (BTU/lb/°F)	-	Calculated
Copper Peel	9.1 (1.6)		lbs/in (N/mm)		IPC-TM-650 2.4.8
Flammability	V-O				UL 94
Lead-Free Process Com- patible	YES

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

Laminados revestidos de cobre

RT duroid 6202 PCB Material High Frequency Laminates Copper Clad Sheet

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Laminado revestido de cobre de 0,

1 mm,

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

Laminados revestidos de cobre

RT duroid 6202 PCB material

high frequency copper clad laminate

duroid 6202 copper clad sheet

Laminado revestido de cobre de 0,

1 mm,