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CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

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Laminados revestidos de cobre

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CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

CLTE-MW

Espessura do laminado:

0,003” (0,076 mm) ± 0,0005” 0,004” (0,102 mm) ± 0,0005” 0,005” (0,127 mm) ± 0,0007” 0,006” (0,152 mm

Tamanho do laminado:

12"X 18"(305X457mm) 24"X 18"(610X457mm)

Peso de cobre:

Folha de cobre eletrodepositada com tratamento reverso 1/2 onça. (18 µm) 1 onça. (35 µm) 2 onças. (7

Destacar:

CLTE-MW PCB high frequency laminate

copper clad sheet PCB material

high frequency copper clad laminates

Descrição do produto

CLTE-MW laminates are ceramic-filled, woven glass reinforced PTFE composites, engineered to offer circuit designers a cost-effective, high-performance material solution. This unique laminate system is particularly well-suited for applications where thickness constraints exist due to physical or electrical requirements.

With seven available thickness options ranging from 3 mils to 10 mils, CLTE-MW™ ensures optimal signal-to-ground spacing for today's 5G and other millimeter-wave designs. A variety of copper foil options are available, including rolled, reverse-treated ED, and standard ED copper. Resistive foil and metal plate options are also available upon request.

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Excellent Dimensional Stability: Critical for maintaining registration of small circuit features
Low X, Y & Z-Axis CTE: Ensures reliable mechanical performance under thermally challenging environments
Low Loss Tangent: Minimizes circuit losses for improved efficiency
Available in Thicknesses from 3-10 mils: Suitable for very high frequency applications requiring precise impedance control

Typical Applications

Commercial Communications and Avionics
Military and Aerospace Applications
Microwave Feed Networks
Phase Sensitive Electronic Structures
Satellite Communication Systems
Passive Components (couplers, filters, and baluns)

Properties	Typical Value	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	2.94–3.02 ±0.04	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	3.03–3.10	–	C-24/23/50, 8–40 GHz	Microstrip Differential Phase Length
Dissipation Factor	0.0015	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-35	ppm/°C	0–100°C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.3×10⁷	MΩ·cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	2.5×10⁶	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Dielectric Strength	630	V/mil	–	IPC TM-650 2.5.6.2
Dielectric Breakdown	44	kV	D-48/50	IPC TM-650 2.5.6
Comparative Tracking Index (CTI)	600	V	C-40/23/50	UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)	500	°C	2 hrs @ 105°C, 5% Weight Loss	IPC TM-650 2.3.40
CTE (x-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (y-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (z-axis)	30	ppm/°C	–	IPC TM-650 2.4.24
Thermal Conductivity	0.42	W/(m·K)	Z Direction	ASTM D5470
Time to Delamination (T288)	>60	minutes	10 s @ 288°C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength	1.1 (6.0)	N/mm (lbs/in)	as-received, 35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	113, 99 (16.4, 14.4)	MPa (ksi)	25°C ±3°C	ASTM D790
Tensile Strength (MD, CMD)	83, 80 (12.0, 11.6)	MPa (ksi)	23°C @ 50% RH	ASTM D3039/D3039-14
Flex Modulus (MD, CMD)	6468, 6360 (938.1, 922.4)	MPa (ksi)	25°C ±3°C	IPC TM-650 2.4.4
Dimensional Stability (MD, CMD)	0.22, 0.22	mil/inch	after etch + bake	IPC-TM-650 2.4.39a
Physical & Environmental Properties
Flammability	V-0	–	–	UL 94
Moisture Absorption	0.03	%	E1/105+D48/50	IPC TM-650 2.6.2.1
Density	2.1	g/cm³	C24/23/50	ASTM D792
Specific Heat Capacity	0.93	J/g·K	2 hrs at 105°C	ASTM E2716
NASA Outgassing (TML)	0.03	%	–	ASTM E595
NASA Outgassing (CVCM)	<0.01	%	–	ASTM E595

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 1

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Laminado revestido de cobre de 0,

1 mm,

Laminado revestido de cobre BME217

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Laminados revestidos de cobre

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

CLTE-MW

Espessura do laminado:

0,003” (0,076 mm) ± 0,0005” 0,004” (0,102 mm) ± 0,0005” 0,005” (0,127 mm) ± 0,0007” 0,006” (0,152 mm

Tamanho do laminado:

12"X 18"(305X457mm) 24"X 18"(610X457mm)

Peso de cobre:

Folha de cobre eletrodepositada com tratamento reverso 1/2 onça. (18 µm) 1 onça. (35 µm) 2 onças. (7

Quantidade de ordem mínima:

1 unidade

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo + caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T

Habilidade da fonte:

5000 PCS por mês

Destacar

CLTE-MW PCB high frequency laminate

copper clad sheet PCB material

high frequency copper clad laminates

Descrição do produto

CLTE-MW PCB Material High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Excellent Dimensional Stability: Critical for maintaining registration of small circuit features
Low X, Y & Z-Axis CTE: Ensures reliable mechanical performance under thermally challenging environments
Low Loss Tangent: Minimizes circuit losses for improved efficiency
Available in Thicknesses from 3-10 mils: Suitable for very high frequency applications requiring precise impedance control

Typical Applications

Commercial Communications and Avionics
Military and Aerospace Applications
Microwave Feed Networks
Phase Sensitive Electronic Structures
Satellite Communication Systems
Passive Components (couplers, filters, and baluns)

Properties	Typical Value	Units	Test Conditions	Test Method
Electrical Properties
Dielectric Constant (process)	2.94–3.02 ±0.04	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Dielectric Constant (design)	3.03–3.10	–	C-24/23/50, 8–40 GHz	Microstrip Differential Phase Length
Dissipation Factor	0.0015	–	23°C @ 50% RH, 10 GHz	IPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant	-35	ppm/°C	0–100°C, 10 GHz	IPC TM-650 2.5.5.5
Volume Resistivity	1.3×10⁷	MΩ·cm	C96/35/90	IPC TM-650 2.5.17.1
Surface Resistivity	2.5×10⁶	MΩ	C96/35/90	IPC TM-650 2.5.17.1
Dielectric Strength	630	V/mil	–	IPC TM-650 2.5.6.2
Dielectric Breakdown	44	kV	D-48/50	IPC TM-650 2.5.6
Comparative Tracking Index (CTI)	600	V	C-40/23/50	UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)	500	°C	2 hrs @ 105°C, 5% Weight Loss	IPC TM-650 2.3.40
CTE (x-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (y-axis)	8	ppm/°C	-55°C to 288°C	IPC TM-650 2.4.41
CTE (z-axis)	30	ppm/°C	–	IPC TM-650 2.4.24
Thermal Conductivity	0.42	W/(m·K)	Z Direction	ASTM D5470
Time to Delamination (T288)	>60	minutes	10 s @ 288°C	IPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength	1.1 (6.0)	N/mm (lbs/in)	as-received, 35 μm foil	IPC TM-650 2.4.8
Flexural Strength (MD, CMD)	113, 99 (16.4, 14.4)	MPa (ksi)	25°C ±3°C	ASTM D790
Tensile Strength (MD, CMD)	83, 80 (12.0, 11.6)	MPa (ksi)	23°C @ 50% RH	ASTM D3039/D3039-14
Flex Modulus (MD, CMD)	6468, 6360 (938.1, 922.4)	MPa (ksi)	25°C ±3°C	IPC TM-650 2.4.4
Dimensional Stability (MD, CMD)	0.22, 0.22	mil/inch	after etch + bake	IPC-TM-650 2.4.39a
Physical & Environmental Properties
Flammability	V-0	–	–	UL 94
Moisture Absorption	0.03	%	E1/105+D48/50	IPC TM-650 2.6.2.1
Density	2.1	g/cm³	C24/23/50	ASTM D792
Specific Heat Capacity	0.93	J/g·K	2 hrs at 105°C	ASTM E2716
NASA Outgassing (TML)	0.03	%	–	ASTM E595
NASA Outgassing (CVCM)	<0.01	%	–	ASTM E595