Detalhes dos produtos

Para casa > produtos >

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet

produtos

Laminados revestidos de cobre

Contacte-nos

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contacte agora

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

Duróide RT 6202PR

Espessura do laminado:

0,010” (0,252 mm) +/- 0,0007”; 0,020” (0,508 mm) +/- 0,0015”

Tamanho do laminado:

12" X 18" (305 mm X 457 mm) 24" X 18" (610 mm X 457 mm)

Peso de cobre:

Folha de cobre eletrodepositada ½ onça. (18 µm) HH/HH 1 onça. (35 µm) H1/H1; Folha de cobre laminada

Destacar:

RT duroid 6202PR copper clad laminate

high frequency laminates substrate

copper clad sheet with warranty

Descrição do produto

RT/duroid 6202PR is a high-frequency circuit material engineered as a low-loss, low-dielectric-constant laminate. It combines superior electrical and mechanical properties essential for designing complex microwave structures that demand both mechanical reliability and electrical stability, and is specifically suited for planar resistor applications.

The incorporation of limited woven glass reinforcement achieves excellent dimensional stability (0.05 to 0.07 mils/inch), enabling the production of tight-tolerance planar resistors.

Cladding Options and Dielectric Thicknesses

A wide range of copper cladding options is available on standard dielectric thicknesses of 0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), and 0.020" (0.508mm):

Electrodeposited copper foil: ¼ oz. to 2 oz./ft.²

Rolled copper foil: ½ oz., 1 oz., and 2 oz.

Reverse-treated foil: ½ oz., 1 oz., and 2 oz.

Electrodeposited copper foil with a resistive layer: ½ oz. and 1 oz.

For applications requiring non-reinforced material, RT/duroid 6002PR is available in 0.020" and 0.030" dielectric thicknesses.

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Delivers excellent high-frequency performance.
Excellent Mechanical and Electrical Properties: Enables reliable multi-layer board constructions.
Tight Dielectric Constant and Thickness Controls: Ensures consistent electrical performance.
Extremely Low Thermal Coefficient of Dielectric Constant: Ideal for applications sensitive to temperature change; maintains electrical stability across a wide temperature range.
Excellent Dimensional Stability: Allows for the manufacture of high-precision circuits; the in-plane expansion coefficient is matched to copper.
Coefficient of Thermal Expansion (CTE) Matched to Copper: Allows for more reliable surface-mounted assemblies and plated through-holes.

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multi-layer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

PROPERTY VALUE RT/duroid 6202PR Thickness Tolerance				DIRECTION UNITS[1] CONDITION TEST METHOD
Dielectric Constant, εr Process and Design [2]	0.005”		2.90 ± 0.04	Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
	0.010”		2.98 ± 0.04
	0.020”		2.90 ± 0.04
Dissipation Factor, Tan δ	0.0020			Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+13				ppm/°C	10 GHz /0-100°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	1010			Z	Mohm•cm	A	ASTM D257
Surface Resistivity	109			X,Y,Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)			X,Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	4.3				%
Ultimate Strain	4.9
Compressive Modulus	1035 (150)			Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.1			-	%	D24/23	IPC-TM-650, 2.6.2.1
Thermal Conductivity	0.68			-	W/mK	80°C	ASTM C518
Coefficient of Thermal Expansion	15			X,Y	ppm/°C	23°C/ 50% RH	IPC-TM-650 2.4.41
	30			Z
Td	500				°CTGA		ASTM D3850
Initial Design Values for Resis- tive Foil	Foil Nominal	Laminate Nominal			ohms/square
	25	27
	50	60
	100 [3]	157
Density	2.1				gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)				J/g/K (BTU/lb/°F)		Calculated
Dimensional Stability	0.07			X,Y	mm/m (mil/inch)	after etch +E2/150	IPC-TM-650 2.4.3.9
Flammability	V-0						UL94
Lead Free Process Compatible	Yes

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet 1

Tags:

Laminado revestido de cobre de 0,

1 mm,

Laminado revestido de cobre BME217

Produtos recomendados

F4BME275 Substrate High Frequency Laminates Copper Clad Sheet

Contacte agora

F4BM275 Substrate High Frequency Laminates Copper Clad Sheet

Contacte agora

F4BME265 Substrate High Frequency Laminates Copper Clad Sheet

Contacte agora

F4BM265 Substrate High Frequency Laminates Copper Clad Sheet

Contacte agora

F4BTMS265 Substrate High Frequency Laminates Copper Clad Sheet

Contacte agora

TLX-6 Substrato de laminados de alta frequência

Contacte agora

TLX-7 Laminados de substrato de alta frequência

Contacte agora

Detalhes dos produtos

produtos

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

Laminados revestidos de cobre

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet

MOQ:	1 unidade
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo + caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T
Capacidade de abastecimento:	5000 PCS por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

China

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-332.V1.0

Número da peça:

Duróide RT 6202PR

Espessura do laminado:

0,010” (0,252 mm) +/- 0,0007”; 0,020” (0,508 mm) +/- 0,0015”

Tamanho do laminado:

12" X 18" (305 mm X 457 mm) 24" X 18" (610 mm X 457 mm)

Peso de cobre:

Folha de cobre eletrodepositada ½ onça. (18 µm) HH/HH 1 onça. (35 µm) H1/H1; Folha de cobre laminada

Quantidade de ordem mínima:

1 unidade

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo + caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T

Habilidade da fonte:

5000 PCS por mês

Destacar

RT duroid 6202PR copper clad laminate

high frequency laminates substrate

copper clad sheet with warranty

Descrição do produto

The incorporation of limited woven glass reinforcement achieves excellent dimensional stability (0.05 to 0.07 mils/inch), enabling the production of tight-tolerance planar resistors.

Cladding Options and Dielectric Thicknesses

A wide range of copper cladding options is available on standard dielectric thicknesses of 0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), and 0.020" (0.508mm):

Electrodeposited copper foil: ¼ oz. to 2 oz./ft.²

Rolled copper foil: ½ oz., 1 oz., and 2 oz.

Reverse-treated foil: ½ oz., 1 oz., and 2 oz.

Electrodeposited copper foil with a resistive layer: ½ oz. and 1 oz.

For applications requiring non-reinforced material, RT/duroid 6002PR is available in 0.020" and 0.030" dielectric thicknesses.

RT duroid 6202PR Substrate High Frequency Laminates Copper Clad Sheet 0

Features and Benefits

Low Loss: Delivers excellent high-frequency performance.
Excellent Mechanical and Electrical Properties: Enables reliable multi-layer board constructions.
Tight Dielectric Constant and Thickness Controls: Ensures consistent electrical performance.
Extremely Low Thermal Coefficient of Dielectric Constant: Ideal for applications sensitive to temperature change; maintains electrical stability across a wide temperature range.
Excellent Dimensional Stability: Allows for the manufacture of high-precision circuits; the in-plane expansion coefficient is matched to copper.
Coefficient of Thermal Expansion (CTE) Matched to Copper: Allows for more reliable surface-mounted assemblies and plated through-holes.

Typical Applications

Phased Array Antennas
Ground-Based and Airborne Radar Systems
Global Positioning System (GPS) Antennas
Power Backplanes
High-Reliability Complex Multi-layer Circuits
Commercial Airline Collision Avoidance Systems
Beam Forming Networks

PROPERTY VALUE RT/duroid 6202PR Thickness Tolerance				DIRECTION UNITS[1] CONDITION TEST METHOD
Dielectric Constant, εr Process and Design [2]	0.005”		2.90 ± 0.04	Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
	0.010”		2.98 ± 0.04
	0.020”		2.90 ± 0.04
Dissipation Factor, Tan δ	0.0020			Z		10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	+13				ppm/°C	10 GHz /0-100°C	IPC-TM-650, 2.5.5.5
Volume Resistivity	1010			Z	Mohm•cm	A	ASTM D257
Surface Resistivity	109			X,Y,Z	Mohm	A	ASTM D257
Tensile Modulus	1007 (146)			X,Y	MPa (kpsi)	23°C	ASTM D638
Ultimate Stress	4.3				%
Ultimate Strain	4.9
Compressive Modulus	1035 (150)			Z	MPa (kpsi)		ASTM D638
Moisture Absorption	0.1			-	%	D24/23	IPC-TM-650, 2.6.2.1
Thermal Conductivity	0.68			-	W/mK	80°C	ASTM C518
Coefficient of Thermal Expansion	15			X,Y	ppm/°C	23°C/ 50% RH	IPC-TM-650 2.4.41
	30			Z
Td	500				°CTGA		ASTM D3850
Initial Design Values for Resis- tive Foil	Foil Nominal	Laminate Nominal			ohms/square
	25	27
	50	60
	100 [3]	157
Density	2.1				gm/cm3		ASTM D792
Specific Heat	0.93 (0.22)				J/g/K (BTU/lb/°F)		Calculated
Dimensional Stability	0.07			X,Y	mm/m (mil/inch)	after etch +E2/150	IPC-TM-650 2.4.3.9
Flammability	V-0						UL94
Lead Free Process Compatible	Yes