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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

MOQ:	1pcs
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T.
Capacidade de abastecimento:	5000pcs por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

CHINA

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-052.V1.0

Material base:

ROGERS RO4003C

Contagem de camadas:

4 camadas

Espessura da PCB:

4,8 mm

Tamanho da PCB:

60 mm x 60 mm por peça, com uma tolerância de +/- 0,15mm

Peso de cobre:

1oz (1,4 mils) para camadas interna e externa

Acabamento superficial:

Gold de imersão em níquel com eletrólito (enig)

Destacar:

4-layer Rogers PCB Board

60mm x 60mm size Rogers RO4003C PCB

4.8mm thickness High-Frequency PCB

Descrição do produto

Rogers RO4003C PCB 4-Layer with countersunk holes

This high-performance 4-layer PCB is engineered using Rogers' RO4003C material--a woven glass reinforced hydrocarbon/ceramic laminate--to deliver exceptional electrical performance and manufacturability, making it ideal for high-frequency and RF applications.

PCB Construction Details

Parameter	Details
Base Material	Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability.
Layer Count	4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality.
Board Dimensions	60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit.
Minimum Trace/Space	4/5 mils, enabling fine signal routing critical for high-frequency operations.
Minimum Hole Size	0.4mm, accommodating small components and ensuring reliable interconnections.
Finished Board Thickness	4.8mm, providing robust structural integrity for demanding applications.
Finished Copper Weight	1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling.
Surface Finish	Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact.
Silkscreen	Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer.
Solder Mask	No solder mask on either top or bottom layers.
Special Features	Includes countersunk holes (conical, 90-degree) for secure mounting.
Quality Assurance	Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications.

PCB Stack-up

The 5-layer rigid PCB features a precise stack-up designed for optimal signal integrity and thermal stability:

Layer	Specification
Copper Layer 1	35 μm, providing a solid conductive path for high-frequency signals.
Rogers 4003C Core	0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties.
Copper Layer 2	35 μm, facilitating intermediate signal routing.
Prepreg RO4450F (x2)	0.204mm total thickness, ensuring reliable adhesion between layers.
Rogers 4003C Core	1.524mm (60mil) thickness, serving as a central insulating layer.
Prepreg RO4450F (x2)	0.204mm total thickness, maintaining layer bonding.
Rogers 4003C Core	1.524mm (60mil) thickness, enhancing structural rigidity and insulation.
Prepreg RO4450F (x2)	0.204mm total thickness, ensuring layer integrity.
Copper Layer 3	35 μm, supporting additional signal and power routing.
Rogers 4003C Core	0.508mm (20mil) thickness, forming the bottom insulating layer.
Copper Layer 4	35 μm, mirroring the top layer for balanced electrical performance.

Artwork and Standards

Artwork Supplied:

Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with production processes.

Quality Standard:

Manufactured to IPC-Class-2 specifications, guaranteeing high quality and reliability for general and high-frequency electronics.

RO4003C Material Overview

Rogers' RO4003C is a woven glass reinforced hydrocarbon/ceramic laminate that combines the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. It is available in configurations using 1080 and 1674 glass fabrics, all meeting the same electrical performance standards.

Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying manufacturing. It is non-brominated and not UL 94 V-0 rated.

Key Features of RO4003C

Dielectric Constant: 3.38 +/-0.05 at 10GHz, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss across frequencies.
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, maintaining stability over temperature ranges.
Thermal Conductivity: 0.71 W/m/°K, enabling efficient heat dissipation.
CTE: X-axis: 11ppm/°C, Y-axis: 14ppm/°C, Z-axis: 46ppm/°C, ensuring dimensional stability and compatibility with copper.
Moisture Absorption: 0.06%, maintaining performance in humid environments.
Tg: >280°C (536°F), ensuring stable expansion characteristics during processing.

Benefits of the PCB

Ideal for Multi-Layer Constructions: RO4003C's properties support complex multi-layer board designs, critical for high-frequency applications.
Cost-Effective Manufacturing: Processes like FR-4 at a fraction of the cost of conventional microwave laminates, reducing production expenses.
High-Volume Compatibility: Designed for performance-sensitive, high-volume applications without compromising on quality.
Reliable Through-Holes: Low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock conditions.
Dimensional Stability: CTE similar to copper enhances stability, making it suitable for mixed dielectric multi-layer boards.

Typical Applications

This PCB is well-suited for:

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
Low-Noise Blocks (LNB's) for Direct Broadcast Satellites

Availability:

This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project requirements.

Tags:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

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Rogers RO4003C PCB Board 4-Layer with 60mm x 60mm Size and 4.8mm Thickness for High-Frequency Applications

MOQ:	1pcs
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T.
Capacidade de abastecimento:	5000pcs por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

CHINA

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-052.V1.0

Material base:

ROGERS RO4003C

Contagem de camadas:

4 camadas

Espessura da PCB:

4,8 mm

Tamanho da PCB:

60 mm x 60 mm por peça, com uma tolerância de +/- 0,15mm

Peso de cobre:

1oz (1,4 mils) para camadas interna e externa

Acabamento superficial:

Gold de imersão em níquel com eletrólito (enig)

Quantidade de ordem mínima:

1pcs

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo+caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T.

Habilidade da fonte:

5000pcs por mês

Destacar

4-layer Rogers PCB Board

60mm x 60mm size Rogers RO4003C PCB

4.8mm thickness High-Frequency PCB

Descrição do produto

Rogers RO4003C PCB 4-Layer with countersunk holes

PCB Construction Details

Parameter	Details
Base Material	Rogers' RO4003C, a proprietary woven glass reinforced hydrocarbon/ceramic material combining PTFE/woven glass electrical performance with epoxy/glass manufacturability.
Layer Count	4-layer rigid PCB, optimized for complex high-frequency signal routing and multi-layer functionality.
Board Dimensions	60mm x 60mm per piece, with a tolerance of +/- 0.15mm for precise assembly fit.
Minimum Trace/Space	4/5 mils, enabling fine signal routing critical for high-frequency operations.
Minimum Hole Size	0.4mm, accommodating small components and ensuring reliable interconnections.
Finished Board Thickness	4.8mm, providing robust structural integrity for demanding applications.
Finished Copper Weight	1oz (1.4 mils) for both inner and outer layers, ensuring low resistance and efficient current handling.
Surface Finish	Electroless Nickel Immersion Gold (ENIG), offering excellent corrosion resistance, solderability, and stable electrical contact.
Silkscreen	Black silkscreen on the top layer for clear component labeling; no silkscreen on the bottom layer.
Solder Mask	No solder mask on either top or bottom layers.
Special Features	Includes countersunk holes (conical, 90-degree) for secure mounting.
Quality Assurance	Undergoes 100% electrical testing prior to shipment, ensuring faultless performance and compliance with design specifications.

PCB Stack-up

The 5-layer rigid PCB features a precise stack-up designed for optimal signal integrity and thermal stability:

Layer	Specification
Copper Layer 1	35 μm, providing a solid conductive path for high-frequency signals.
Rogers 4003C Core	0.508mm (20mil) thickness, forming the top insulating layer with stable dielectric properties.
Copper Layer 2	35 μm, facilitating intermediate signal routing.
Prepreg RO4450F (x2)	0.204mm total thickness, ensuring reliable adhesion between layers.
Rogers 4003C Core	1.524mm (60mil) thickness, serving as a central insulating layer.
Prepreg RO4450F (x2)	0.204mm total thickness, maintaining layer bonding.
Rogers 4003C Core	1.524mm (60mil) thickness, enhancing structural rigidity and insulation.
Prepreg RO4450F (x2)	0.204mm total thickness, ensuring layer integrity.
Copper Layer 3	35 μm, supporting additional signal and power routing.
Rogers 4003C Core	0.508mm (20mil) thickness, forming the bottom insulating layer.
Copper Layer 4	35 μm, mirroring the top layer for balanced electrical performance.

Artwork and Standards

Artwork Supplied:

Gerber RS-274-X, the industry-standard format for PCB manufacturing, ensuring compatibility with production processes.

Quality Standard:

Manufactured to IPC-Class-2 specifications, guaranteeing high quality and reliability for general and high-frequency electronics.

RO4003C Material Overview

Unlike PTFE-based materials, RO4003C requires no special through-hole treatments or handling procedures, simplifying manufacturing. It is non-brominated and not UL 94 V-0 rated.

Key Features of RO4003C

Dielectric Constant: 3.38 +/-0.05 at 10GHz, ensuring consistent signal propagation.
Dissipation Factor: 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss across frequencies.
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, maintaining stability over temperature ranges.
Thermal Conductivity: 0.71 W/m/°K, enabling efficient heat dissipation.
CTE: X-axis: 11ppm/°C, Y-axis: 14ppm/°C, Z-axis: 46ppm/°C, ensuring dimensional stability and compatibility with copper.
Moisture Absorption: 0.06%, maintaining performance in humid environments.
Tg: >280°C (536°F), ensuring stable expansion characteristics during processing.

Benefits of the PCB

Ideal for Multi-Layer Constructions: RO4003C's properties support complex multi-layer board designs, critical for high-frequency applications.
Cost-Effective Manufacturing: Processes like FR-4 at a fraction of the cost of conventional microwave laminates, reducing production expenses.
High-Volume Compatibility: Designed for performance-sensitive, high-volume applications without compromising on quality.
Reliable Through-Holes: Low Z-axis CTE ensures reliable plated through-hole quality, even in severe thermal shock conditions.
Dimensional Stability: CTE similar to copper enhances stability, making it suitable for mixed dielectric multi-layer boards.

Typical Applications

This PCB is well-suited for:

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
Low-Noise Blocks (LNB's) for Direct Broadcast Satellites

Availability:

This PCB is available for worldwide shipping, ensuring accessibility for global manufacturing and project requirements.

Tags: