| MOQ: | 1pcs |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T. |
| Capacidade de abastecimento: | 5000pcs por mês |
This PCB is a high-performance 2-layer rigid RF (Radio Frequency) board, constructed using Rogers RO4350B material. It is tailored for applications requiring reliable RF performance, cost-effectiveness, and compatibility with standard manufacturing processes, making it an excellent choice for cellular infrastructure, automotive radar systems, and satellite communication components.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers RO4350B (woven glass-reinforced hydrocarbon/ceramic laminate) |
| Layer Count | 2-layer (rigid RF structure) |
| Board Dimensions | 80mm x 75mm per piece, ±0.15mm tolerance |
| Minimum Trace/Space | 4 mils (trace) / 4 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; 20 μm plating thickness |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers (Copper_layer_1 & Copper_layer_2) |
| Surface Finish | Immersion Gold |
| Silkscreen | White (top layer); None (bottom layer) |
| Solder Mask | None (top and bottom layers) |
| Quality Assurance | 100% electrical testing before shipment |
2. PCB Stack-up Configuration
The 2-layer rigid RF PCB features a simplified yet high-performance stackup, optimized for consistent RF signal transmission and mechanical stability. Each layer is carefully selected to align with the material’s strengths and the board’s functional needs:
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz finished weight) |
| Core Layer | Rogers RO4350B | 1.524mm (60mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm |
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3. Artwork and Quality Standards
This PCB meets industry standards for compatibility and reliability:
Artwork Format: Gerber RS-274-X, the universal format ensuring seamless manufacturing integration.
Quality Standard: IPC-Class-2 compliant, suitable for commercial/industrial RF systems.
Availability: This PCB is globally accessible for production and delivery.
4. Introduction to Rogers RO4350B Base Material
Rogers RO4350B is a proprietary high-performance material engineered to bridge the gap between premium PTFE-based RF laminates and cost-effective epoxy/glass boards. It is a woven glass-reinforced hydrocarbon/ceramic composite that delivers electrical performance comparable to PTFE/woven glass (low loss, stable dielectric constant) while maintaining the manufacturability of standard epoxy/glass laminates.
A key advantage of RO4350B is its cost efficiency—it is available at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, it does not require special through-hole treatments or delicate handling procedures, simplifying manufacturing and reducing production costs. Additionally, it holds a UL 94 V-0 flammability rating, making it suitable for active RF devices and high-power RF designs where safety is critical.
5. Key Features of RO4350B Material
| Property | Value | Significance |
| Dielectric Constant (Dk) | 3.48 ± 0.05 (10GHz/23°C) | Consistent RF signal propagation; critical for antenna and amplifier designs |
| Dissipation Factor | 0.0037 (10GHz/23°C) | Low signal loss; preserves RF signal strength in high-frequency paths |
| Thermal Coefficient of Dk | +50 ppm/°C (-50°C to 150°C) | Stable Dk across temperature ranges; ideal for automotive/outdoor use |
| Thermal Conductivity | 0.69 W/m/°K | Efficient heat management; protects RF components from overheating |
| CTE (X/Y/Z axes) | 10/12/32 ppm/°C | Low in-plane expansion matches copper; reduces thermal stress |
| Glass Transition Temperature (Tg) | >280°C | High thermal stability; supports lead-free soldering |
| Water Absorption | 0.06% | Minimal moisture impact; stable performance in humid environments |
| Flammability | UL 94 V-0 | Fire safety compliance for enclosed electronic systems |
6. Typical Applications
Leveraging the performance and cost benefits of Rogers RO4350B, this 2-layer RF PCB is well-suited for the following applications:
-Cellular Infrastructure: Cellular base station antennas and power amplifiers (reliable RF performance for long-range signal transmission)
-RF Identification (RFID): RFID tags (low loss and compact design support efficient tag communication)
-Automotive Electronics: Automotive radar and sensors (temperature stability and durability meet automotive environmental demands)
-Satellite Communications: Low Noise Blocks (LNBs) for direct broadcast satellites (stable Dk and low loss ensure clear satellite signal reception)
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| MOQ: | 1pcs |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T. |
| Capacidade de abastecimento: | 5000pcs por mês |
This PCB is a high-performance 2-layer rigid RF (Radio Frequency) board, constructed using Rogers RO4350B material. It is tailored for applications requiring reliable RF performance, cost-effectiveness, and compatibility with standard manufacturing processes, making it an excellent choice for cellular infrastructure, automotive radar systems, and satellite communication components.
1. PCB Specifications
| Parameter | Specification |
| Base Material | Rogers RO4350B (woven glass-reinforced hydrocarbon/ceramic laminate) |
| Layer Count | 2-layer (rigid RF structure) |
| Board Dimensions | 80mm x 75mm per piece, ±0.15mm tolerance |
| Minimum Trace/Space | 4 mils (trace) / 4 mils (space) |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; 20 μm plating thickness |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers (Copper_layer_1 & Copper_layer_2) |
| Surface Finish | Immersion Gold |
| Silkscreen | White (top layer); None (bottom layer) |
| Solder Mask | None (top and bottom layers) |
| Quality Assurance | 100% electrical testing before shipment |
2. PCB Stack-up Configuration
The 2-layer rigid RF PCB features a simplified yet high-performance stackup, optimized for consistent RF signal transmission and mechanical stability. Each layer is carefully selected to align with the material’s strengths and the board’s functional needs:
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz finished weight) |
| Core Layer | Rogers RO4350B | 1.524mm (60mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm |
![]()
3. Artwork and Quality Standards
This PCB meets industry standards for compatibility and reliability:
Artwork Format: Gerber RS-274-X, the universal format ensuring seamless manufacturing integration.
Quality Standard: IPC-Class-2 compliant, suitable for commercial/industrial RF systems.
Availability: This PCB is globally accessible for production and delivery.
4. Introduction to Rogers RO4350B Base Material
Rogers RO4350B is a proprietary high-performance material engineered to bridge the gap between premium PTFE-based RF laminates and cost-effective epoxy/glass boards. It is a woven glass-reinforced hydrocarbon/ceramic composite that delivers electrical performance comparable to PTFE/woven glass (low loss, stable dielectric constant) while maintaining the manufacturability of standard epoxy/glass laminates.
A key advantage of RO4350B is its cost efficiency—it is available at a fraction of the cost of conventional microwave laminates. Unlike PTFE-based materials, it does not require special through-hole treatments or delicate handling procedures, simplifying manufacturing and reducing production costs. Additionally, it holds a UL 94 V-0 flammability rating, making it suitable for active RF devices and high-power RF designs where safety is critical.
5. Key Features of RO4350B Material
| Property | Value | Significance |
| Dielectric Constant (Dk) | 3.48 ± 0.05 (10GHz/23°C) | Consistent RF signal propagation; critical for antenna and amplifier designs |
| Dissipation Factor | 0.0037 (10GHz/23°C) | Low signal loss; preserves RF signal strength in high-frequency paths |
| Thermal Coefficient of Dk | +50 ppm/°C (-50°C to 150°C) | Stable Dk across temperature ranges; ideal for automotive/outdoor use |
| Thermal Conductivity | 0.69 W/m/°K | Efficient heat management; protects RF components from overheating |
| CTE (X/Y/Z axes) | 10/12/32 ppm/°C | Low in-plane expansion matches copper; reduces thermal stress |
| Glass Transition Temperature (Tg) | >280°C | High thermal stability; supports lead-free soldering |
| Water Absorption | 0.06% | Minimal moisture impact; stable performance in humid environments |
| Flammability | UL 94 V-0 | Fire safety compliance for enclosed electronic systems |
6. Typical Applications
Leveraging the performance and cost benefits of Rogers RO4350B, this 2-layer RF PCB is well-suited for the following applications:
-Cellular Infrastructure: Cellular base station antennas and power amplifiers (reliable RF performance for long-range signal transmission)
-RF Identification (RFID): RFID tags (low loss and compact design support efficient tag communication)
-Automotive Electronics: Automotive radar and sensors (temperature stability and durability meet automotive environmental demands)
-Satellite Communications: Low Noise Blocks (LNBs) for direct broadcast satellites (stable Dk and low loss ensure clear satellite signal reception)
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