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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
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Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
  • Nome

Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Rogers TC600
Contagem de camadas:
2 camadas
Espessura da PCB:
0,8 mm
Tamanho da placa de circuito impresso:
112 mm x 60 mm (1 peça) ± 0,15 mm
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Níquel sem eléctroPalladio sem eléctro e ouro por imersão (ENEPIG)
Destacar:

Rogers TC600 PCB board

,

Double-sided ENEPIG PCB

,

0.8mm Rogers PCB

Descrição do produto
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
This 2-layer RF PCB is constructed with Rogers TC600--a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.
PCB Specification
Parameter Details
Base Material Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count Double sided (2-layer rigid PCB)
Board Dimensions 112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Via Type No blind vias (thru-hole vias only)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen Top: White; Bottom: No
Solder Mask Top: Green; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up Details
Layer Type Material/Description Thickness
Copper Layer (Top) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Dielectric Layer Rogers TC600 0.762 mm (30 mils)
Copper Layer (Bottom) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Material Overview: Rogers TC600 Laminates
Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability--making it a top choice for avionics, antennas, and power amplifiers.
Key Material Features
Specification Value
Material Type PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk) 6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ) 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity 1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk) -75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE) X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption 0.03%
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 0
Core Benefits
Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.
Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.
Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.
Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).
Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.
Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.
Typical Applications
This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:
  • Power Amplifiers, Filters, and Couplers
  • Microwave Combiner and Power Divider Boards (Avionics Applications)
  • Small Footprint Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • GPS & Hand-held RFID Reader Antennas
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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produtos
Detalhes dos produtos
produtos

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
  • Nome
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações pormenorizadas
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Rogers TC600
Contagem de camadas:
2 camadas
Espessura da PCB:
0,8 mm
Tamanho da placa de circuito impresso:
112 mm x 60 mm (1 peça) ± 0,15 mm
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Níquel sem eléctroPalladio sem eléctro e ouro por imersão (ENEPIG)
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo+caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000pcs por mês
Destacar

Rogers TC600 PCB board

,

Double-sided ENEPIG PCB

,

0.8mm Rogers PCB

Descrição do produto
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish
This 2-layer RF PCB is constructed with Rogers TC600--a specialized composite of PTFE, thermally conductive ceramic fillers, and woven glass reinforcement. Engineered to deliver exceptional thermal conductivity (for heat management) and low dielectric loss (for signal integrity), it meets IPC-Class-2 standards and is ideal for power-dense, space-constrained applications like amplifiers, antennas, and avionics components.
PCB Specification
Parameter Details
Base Material Rogers TC600 (PTFE + thermally conductive ceramic fillers + woven glass reinforcement)
Layer Count Double sided (2-layer rigid PCB)
Board Dimensions 112mm x 60mm (1 piece)±0.15mm
Minimum Trace/Space 5/5 mils
Minimum Hole Size 0.3mm
Via Type No blind vias (thru-hole vias only)
Finished Board Thickness 0.8mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils total: 18μm base copper + 17μm plating per layer)
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium and Immersion Gold (ENEPIG)
Silkscreen Top: White; Bottom: No
Solder Mask Top: Green; Bottom: No
Quality Assurance 100% Electrical test prior to shipment
PCB Stack-up Details
Layer Type Material/Description Thickness
Copper Layer (Top) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Dielectric Layer Rogers TC600 0.762 mm (30 mils)
Copper Layer (Bottom) 18μm base copper + 17μm plating (finished: 1oz / 35μm total) 35 μm (1oz)
Material Overview: Rogers TC600 Laminates
Rogers TC600 is a advanced composite laminate designed to address two critical challenges in high-frequency and power-dense circuits: thermal management and signal loss. By combining PTFE (for low dielectric loss) with thermally conductive ceramic fillers (for heat transfer) and woven glass reinforcement (for mechanical robustness), TC600 delivers "best-in-class" thermal conductivity while minimizing dielectric and insertion loss. This unique formulation enables PCB size reduction (via higher efficiency), improves power handling, reduces hotspots, and enhances long-term device reliability--making it a top choice for avionics, antennas, and power amplifiers.
Key Material Features
Specification Value
Material Type PTFE + thermally conductive ceramic fillers + woven glass reinforcement
Dielectric Constant (Dk) 6.15 at 1.8 MHz and 10 GHz / 23°C
Dissipation Factor (tanδ) 0.0017 at 1.8 GHz; 0.0020 at 10 GHz / 23°C
Thermal Conductivity 1.1 W/mK
Temperature Coefficient of Dielectric Constant (TCDk) -75 ppm/°C (range: -40°C to 140°C)
Coefficient of Thermal Expansion (CTE) X-axis: 9 ppm/°C; Y-axis: 9 ppm/°C; Z-axis: 35 ppm/°C
Moisture Absorption 0.03%
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 0
Core Benefits
Enables Compact Design: Higher efficiency (from low loss) and thermal performance allow for smaller PCB footprints compared to lower-Dk substrates, ideal for space-constrained systems.
Superior Thermal Management: Best-in-class thermal conductivity (1.1 W/mK) reduces heat buildup, minimizes hotspots, and boosts power handling--extending component lifespan.
Low Signal Loss: Ultra-low dielectric loss (0.0017-0.0020) preserves signal integrity, leading to higher amplifier/antenna gains and efficiencies.
Stable Performance Across Temperatures: Consistent Dk (TCDk: -75 ppm/°C) and low CTE ensure reliability in extreme temperature ranges (-40°C to 140°C).
Reliable Component Integration: CTE closely matches active components, reducing stress on solder joints and improving long-term assembly reliability.
Easy Processing: Mechanical robustness (from woven glass reinforcement) simplifies manufacturing while maintaining dimensional stability.
Typical Applications
This PCB is optimized for high-power, high-frequency systems requiring thermal efficiency and signal integrity, including:
  • Power Amplifiers, Filters, and Couplers
  • Microwave Combiner and Power Divider Boards (Avionics Applications)
  • Small Footprint Antennas
  • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
  • GPS & Hand-held RFID Reader Antennas
Rogers Double-Sided TC600 PCB 0.8mm ENEPIG Finish 1
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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