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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
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LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Nome

LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Perfil baixo Rogers RO4350B (LoPro)
Contagem de camadas:
2 camadas
Espessura da PCB:
1,6 mm
Tamanho da placa de circuito impresso:
43mm x 56mm por peça (1PCS)
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
ENEPIG (Níquel Electroless Paládio Electroless e Ouro de Imersão)
Destacar:

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Descrição do produto
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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produtos
Detalhes dos produtos
produtos

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
  • Nome
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações pormenorizadas
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Perfil baixo Rogers RO4350B (LoPro)
Contagem de camadas:
2 camadas
Espessura da PCB:
1,6 mm
Tamanho da placa de circuito impresso:
43mm x 56mm por peça (1PCS)
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
ENEPIG (Níquel Electroless Paládio Electroless e Ouro de Imersão)
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo+caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000pcs por mês
Destacar

LoPro RO4350B PCB board

,

Double-sided Rogers PCB 1.6mm

,

ENEPIG finish PCB board

Descrição do produto
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish
This 2-layer rigid PCB is engineered for high-frequency RF and high-speed digital applications, leveraging Rogers RO4350B Low Profile (LoPro) material--a hydrocarbon ceramic laminate with proprietary reverse-treated foil technology. To achieve superior signal integrity, reduced conductor loss, and cost-efficient manufacturing, it balances performance and practicality for use cases ranging from cellular base stations to high-speed servers.
PCB Specification
Parameter Details
Base Material Rogers RO4350B Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 43mm x 56mm per piece (1PCS)
Minimum Trace/Space 4 mils (trace) / 6 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 1.6mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold)
Silkscreen White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing before shipment
PCB Stack-up
Layer Name Material Thickness
Top Layer (Copper_layer_1) 35 μm thick copper 35 μm (1oz)
Substrate Layer Rogers RO4350B LoPro 1.542mm (60.7mil)
Bottom Layer (Copper_layer_2) 35 μm thick copper 35 μm (1oz)
Rogers RO4350B Low Profile Material
Rogers RO4350B LoPro redefines cost-effective high-frequency design with its proprietary reverse-treated foil technology. This innovation bonds foil directly to standard RO4350B dielectric, delivering reduced conductor loss (and thus improved insertion loss) while retaining all key benefits of standard RO4350B:
FR-4 Process Compatibility: No specialized via preparation (e.g., sodium etch) required - uses standard epoxy/glass fabrication workflows to lower manufacturing costs and lead times.
Hydrocarbon Ceramic Composition: Combines low dielectric loss with mechanical stability, making it ideal for mixed-signal (RF + digital) applications.
Environmental Compliance: Lead-free process compatible and UL 94-V0 rated, meeting global safety and sustainability standards.
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 0
Key Material Features
Feature Specification
Dielectric Constant (Dk) 3.48 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0037 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >390°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.69 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 10 ppm/°C
- Y-axis: 12 ppm/°C
- Z-axis: 32 ppm/°C (-55 to 288°C)
Flammability Rating UL 94-V0
Additional Attributes CAF (Conductive Anodic Filament) resistant; lead-free compatible
Core Benefits
  • Ultra-Low Insertion Loss: Enables reliable operation beyond 40 GHz - critical for high-frequency applications like LNBs and base station antennas.
  • Reduced PIM: Minimizes passive intermodulation for clear signal transmission in cellular infrastructure, avoiding call drops or data degradation.
  • Thermal Resilience: Lower conductor loss improves heat dissipation, while high Tg/Td withstands lead-free soldering and high-temperature operating environments (e.g., server racks, outdoor antennas).
  • Copper-Matched CTE: X/Y-axis CTE (10/12 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling - ensuring long-term reliability.
  • Design Flexibility: Supports multi-layer scalability (for future complex designs) and 2-layer cost-effectiveness, with CAF resistance for durability in humid environments.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4350B PCB Double-Sided 1.6mm Thick ENEPIG Finish 1
Summary
The 2-layer PCB with Rogers RO4350B Low Profile material is a versatile, high-performance solution for RF and high-speed digital applications. By combining low conductor loss, FR-4 compatibility, ENEPIG finish, and industry-leading reliability, it addresses the key challenges of modern electronics - from signal integrity at 40+ GHz to cost-effective volume manufacturing. Its global availability and compliance with IPC-Class-2 standards make it a trusted choice for telecom, data center, satellite, and RFID projects worldwide.
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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