Detalhes dos produtos

Para casa > produtos >

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

produtos

PWB do núcleo do metal

Contacte-nos

Ms. Ivy Deng

sales10@bichengpcb.com

86-755-27374847

Contacte agora

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

MOQ:	1pcs
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T.
Capacidade de abastecimento:	5000pcs por mês

Informações

Descrição do produto

Informações pormenorizadas

Lugar de origem

CHINA

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-052.V1.0

Material base:

Rogers RO4730G3

Contagem de camadas:

2 camadas

Espessura da PCB:

0,6 mm

Tamanho da PCB:

59,6 mm x 40,5 mm (

Peso de cobre:

1oz (equivalente a 1,4 mils ou 35μm)

Acabamento superficial:

Gold de imersão em níquel com eletrólito (enig)

Destacar:

2-layer RF PCB RO4730G3

ENIG finish Rogers PCB

high-frequency Rogers PCB board

Descrição do produto

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

This is a high-quality, double-sided PCB engineered for radio frequency (RF) applications, particularly suited for antenna systems. It is fabricated using Rogers RO4730G3 antenna-grade laminate, ensuring superior electrical performance, reliability, and cost-effectiveness.

1. PCB Specifications

Specification Category	Details
Base Material	Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count	2 layers
Physical Dimensions	- Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes	- Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias	- Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness	Finished board thickness: 0.6 mm
Copper Weight	1 oz (equivalent to 35 μm) on both outer layers
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask	- Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen	- Top side: White legend silkscreen- Bottom side: No silkscreen

2. PCB Stack-up

Layer Position	Material	Thickness
Top Layer	35 μm Copper	35 μm (1oz)
Core Layer	Rogers RO4730G3	0.508mm (20mil)
Bottom Layer	35 μm Copper	35 μm (1oz)

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

Characteristic Category	Technical Specification
Stable Dielectric Constant (Dk)	3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss	Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk)	Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience	- Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE)	- X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation	Thermal Conductivity: 0.45 W/mK

4. Typical Applications:

This PCB is ideally suited for:

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

Availability: This PCB is available for order and shipment worldwide.

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

Tags:

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Produtos recomendados

Rogers RT/duroid 6035HTC PCB 2-Layer 1.6mm Thick

Contacte agora

1.524mm RO4350B PCB Double-Sided Rogers RF Laminate

Contacte agora

Rogers RO3210 PCB 0.6mm Thick with White Silkscreen

Contacte agora

High-Performance 2-Layer Rogers RO3035 PCB with Immersion Gold

Contacte agora

RO3006 PCB 5mil Double-Sided with Pure gold 30u"

Contacte agora

2-layers RT duroid 6002 PCB Rogers 10mil Laminate

Contacte agora

PWB de alta frequência de Rogers 5880 10mil 0.254mm para o Microstrip e os circuitos de Stripline

Contacte agora

Detalhes dos produtos

produtos

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

MOQ:	1pcs
preço:	USD9.99-99.99
Embalagem padrão:	Sacos a vácuo+caixas
Período de entrega:	8-9 dias úteis
Método de pagamento:	T/T.
Capacidade de abastecimento:	5000pcs por mês

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem

CHINA

Marca

Bicheng

Certificação

UL, ISO9001, IATF16949

Número do modelo

BIC-052.V1.0

Material base:

Rogers RO4730G3

Contagem de camadas:

2 camadas

Espessura da PCB:

0,6 mm

Tamanho da PCB:

59,6 mm x 40,5 mm (

Peso de cobre:

1oz (equivalente a 1,4 mils ou 35μm)

Acabamento superficial:

Gold de imersão em níquel com eletrólito (enig)

Quantidade de ordem mínima:

1pcs

Preço:

USD9.99-99.99

Detalhes da embalagem:

Sacos a vácuo+caixas

Tempo de entrega:

8-9 dias úteis

Termos de pagamento:

T/T.

Habilidade da fonte:

5000pcs por mês

Destacar

2-layer RF PCB RO4730G3

ENIG finish Rogers PCB

high-frequency Rogers PCB board

Descrição do produto

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish

1. PCB Specifications

Specification Category	Details
Base Material	Rogers RO4730G3 (hydrocarbon/ceramic laminate) – Low-loss, high-frequency substrate; robust and economical alternative to traditional PTFE-based substrates.
Layer Count	2 layers
Physical Dimensions	- Board size: 59.6mm x 40.5mm (1 piece)- Dimensional tolerance: ±0.15mm
Design Rules – Traces & Holes	- Minimum Trace/Space: 5 mil / 5 mil- Minimum Drill Size: 0.4mm
Design Rules – Vias	- Via Type: Through-hole vias only (no blind vias)- Via Plating Thickness: 20 μm
Board Thickness	Finished board thickness: 0.6 mm
Copper Weight	1 oz (equivalent to 35 μm) on both outer layers
Surface Finish	Electroless Nickel Immersion Gold (ENIG) – Provides a flat, solderable surface with excellent oxidation resistance; optimized for RF performance.
Solder Mask	- Top side: Green (LPI, Liquid Photoimageable) solder mask- Bottom side: No solder mask (exposed copper)
Silkscreen	- Top side: White legend silkscreen- Bottom side: No silkscreen

2. PCB Stack-up

Layer Position	Material	Thickness
Top Layer	35 μm Copper	35 μm (1oz)
Core Layer	Rogers RO4730G3	0.508mm (20mil)
Bottom Layer	35 μm Copper	35 μm (1oz)

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 0

3. Key Material Features & Benefits (RO4730G3):

The use of Rogers RO4730G3 material provides significant advantages for RF designs:

-Optimized RF Performance: Stable dielectric constant (Dk) of 3.00 ± 0.05 at 10 GHz and an ultra-low dissipation factor of 0.0028 for reduced insertion loss.

-Low Passive Intermodulation (PIM): Ideal for cellular base station antennas where signal integrity is critical.

-Excellent Thermal Stability: High Tg >280°C and a low Thermal Coefficient of Dk (34 ppm/°C) ensure consistent electrical performance across temperature variations.

-Ease of Fabrication: Fully compatible with standard FR-4 multi-layer processing and lead-free assembly, eliminating the need for specialized PTFE treatments.

-Lightweight & Robust: Unique filler system makes the material 30% lighter than PTFE/glass and features a CTE matched to copper for enhanced reliability.

-Environmental Compliance: RoHS compliant and compatible with lead-free soldering processes.

Characteristic Category	Technical Specification
Stable Dielectric Constant (Dk)	3.00 ± 0.05 at 10 GHz
Ultra-Low Signal Loss	Dissipation factor of 0.0028 at 10 GHz
Superior Thermal Stability (TCDk)	Thermal Coefficient of Dk: 34 ppm/°C
High Thermal Resilience	- Glass Transition Temperature (Tg): >280°C- Decomposition Temperature (Td): 411°C (TGA)
Controlled Thermal Expansion (CTE)	- X-axis: 15.9 ppm/°C- Y-axis: 14.4 ppm/°C- Z-axis: 35.2 ppm/°C
Efficient Heat Dissipation	Thermal Conductivity: 0.45 W/mK

4. Typical Applications:

This PCB is ideally suited for:

-Cellular Base Station Antennas

-Various other RF and antenna applications requiring stable electrical performance and low loss.

Quality & Testing: Manufactured to IPC-Class-2 standards and undergoes 100% electrical testing prior to shipment to ensure functionality and reliability.

Artwork Format: Gerber RS-274-X– the universal industry standard, compatible with fabrication facilities worldwide.

Availability: This PCB is available for order and shipment worldwide.

High-Frequency 2-Layer RF PCB RO4730G3 Material ENIG Finish 1

Tags: