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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
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LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nome

LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Perfil baixo Rogers RO4003C (LoPro)
Contagem de camadas:
2 camadas
Espessura da PCB:
0,65 mm
Tamanho da placa de circuito impresso:
64mm x 68,4mm por peça (1PCS)
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Revestimento de prata + revestimento de ouro
Destacar:

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descrição do produto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Tags: 

RO4003C LoPro Rogers PCB Board,  

8mil Rogers PCB Board,  

0.5oz Rogers PCB Board

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produtos
Detalhes dos produtos
produtos

Placa do PWB do RF

Placa do PWB de Rogers

Placa do PWB de PTFE

PWB alto do Tg

Multi PWB da camada

PWB Taconic

Placa do PWB de HDI

PWB de alta velocidade

A impedância controlou o PWB

Placa flexível do PWB

placa do PWB fr4

estêncil do PWB

PWB do núcleo do metal
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
  • Nome
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo+caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000pcs por mês
Informações pormenorizadas
Descrição do produto
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-332.V1.0
Material base:
Perfil baixo Rogers RO4003C (LoPro)
Contagem de camadas:
2 camadas
Espessura da PCB:
0,65 mm
Tamanho da placa de circuito impresso:
64mm x 68,4mm por peça (1PCS)
Silkscreen:
Branco
Máscara de solda:
Verde
Peso de cobre:
1 onça (1,4 mils) para camadas externas
Acabamento de superfície:
Revestimento de prata + revestimento de ouro
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo+caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000pcs por mês
Destacar

Rogers PCB board 20.7mil substrate

,

Double-sided LoPro RO4003C PCB

,

Rogers PCB with high-frequency performance

Descrição do produto
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided
This two-layer PCB is meticulously crafted for high-frequency radio frequency (RF) and high-speed digital applications. It utilizes Rogers RO4003C Low Profile (LoPro) material, a hydrocarbon ceramic laminate featuring proprietary reverse-treated foil technology. This combination enables the PCB to achieve superior signal integrity, minimize conductor losses, and ensure cost-efficient manufacturing processes.
PCB Specification
Parameter Details
Base Material Rogers RO4003C Low Profile (LoPro) - Hydrocarbon ceramic laminate with reverse-treated foil
Layer Count 2-Layer (rigid structure)
Board Dimensions 64mm x 68.4mm per piece (1PCS)
Minimum Trace/Space 5 mils (trace) / 5 mils (space)
Minimum Hole Size 0.3mm
Vias No blind vias; via plating thickness = 20 μm
Finished Board Thickness 0.65mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Surface Finish Silver underplating + Gold plating
Silkscreen White silkscreen on top layer, no silkscreen on bottom layer
Solder Mask Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance 100% electrical testing conducted prior to shipment
Rogers RO4003C Low Profile Material Introduction
Rogers RO4003C Low Profile (LoPro) is a game-changing hydrocarbon ceramic laminate that redefines cost-effective high-performance PCB design. Its core innovation lies in proprietary reverse-treated foil technology: this allows the foil to bond directly to standard RO4003C dielectric, creating a laminate with drastically reduced conductor loss--while preserving all the desirable attributes of standard RO4003C (e.g., low dielectric loss, FR-4 process compatibility).
Unlike traditional high-frequency materials (e.g., PTFE-based laminates) that require specialized via preparation (e.g., sodium etch), RO4003C LoPro works with standard epoxy/glass (FR-4) fabrication processes. This eliminates extra manufacturing steps, slashes costs, and makes it accessible to most PCB factories. It's designed to bridge the gap between high-performance RF materials and cost-effective digital substrates, making it ideal for mixed-signal applications.
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 0
RO4003C Low Profile Key Features
Feature Specification
Material Composition Hydrocarbon ceramic laminate with reverse-treated foil
Dielectric Constant (Dk) 3.38 ± 0.05 at 10GHz/23°C
Dissipation Factor (DF) 0.0027 at 10GHz/23°C
Thermal Performance - Decomposition Temp (Td): >425°C
- Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity 0.64 W/mK
Coefficient of Thermal Expansion (CTE) - X-axis: 11 ppm/°C
- Y-axis: 14 ppm/°C
- Z-axis: 46 ppm/°C (-55 to 288°C)
Process Compatibility Lead-free process compatible; standard FR-4 fabrication compatible
Additional Attribute CAF (Conductive Anodic Filament) resistant
Material Benefits
RO4003C LoPro's properties translate to tangible advantages for the PCB, solving key challenges in high-speed/RF design and cost-sensitive manufacturing:
  • Ultra-Low Insertion Loss: Reduced conductor loss enables reliable operation beyond 40 GHz.
  • Minimized Passive Intermodulation (PIM): Low PIM levels prevent signal distortion in high-power RF systems.
  • FR-4 Process Compatibility: Uses standard fabrication workflows (no specialized via treatment) to cut manufacturing costs and lead times.
  • Thermal Resilience: High Tg (>280°C) and Td (>425°C) withstand lead-free soldering and high-temperature operating environments.
  • Copper-Matched CTE: X/Y-axis CTE (11/14 ppm/°C) matches copper, eliminating solder joint stress during thermal cycling.
  • CAF Resistance: Protects against conductive anodic filament formation.
  • Design Flexibility: Supports both multi-layer PCBs (for complex digital circuits) and 2-layer designs, adapting to diverse project needs.
Some Typical Applications
  • Digital applications such as servers, routers, and high speed back planes
  • Cellular base station antennas and power amplifiers
  • LNB's for direct broadcast satellites
  • RF Identification Tags
LoPro RO4003C PCB Rogers 20.7mil Substrate Double-sided 1
Tags: 

RO4003C LoPro Rogers PCB Board,

8mil Rogers PCB Board,

0.5oz Rogers PCB Board

Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan, Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Tel: 86-755-27374946
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