Double-Sided F4BTMS220 RF PCB Board with 0.127mm Thick Core and UL-94 V0 Flame Retardancy

This double-sided rigid PCB is constructed with F4BTMS220, a high-performance and high-reliability base material, along with precise specifications, making it suitable for various demanding applications. Its double-sided design provides sufficient routing space for circuit connections, ensuring efficient and stable signal transmission.

This 2-layer rigid PCB has the following stack-up structure:

• Dielectric Constant (Dk): At 10GHz, the dielectric constant is 2.2 +/- 0.02, ensuring stable signal transmission.
• Dissipation Factor: It has a dissipation factor of 0.0009 at 10GHz and 0.001 at 20GHz, indicating low energy loss.
• CTE (Coefficient of Thermal Expansion): In the temperature range of -55°C to 288°C, the CTE x-axis is 40 ppm/°C, the CTE y-axis is 50 ppm/°C, and the CTE z-axis is 290 ppm/°C, providing good thermal stability.
• Thermal Coefficient of Dk: With a low thermal coefficient of Dk at -130 ppm/°C in the range of -55°C to 150°C, the material's dielectric properties remain stable under temperature changes.
• UL-94 Rating: It meets the UL-94 V0 standard, offering good flame retardancy.
• Moisture Absorption: The moisture absorption is as low as 0.02%, ensuring reliable performance in humid environments.

The artwork supplied for this PCB is Gerber RS-274-X, a widely used format in the PCB industry for manufacturing.

It adheres to the IPC-Class-2 quality standard, ensuring reliable performance in general electronic applications.

This PCB is available worldwide, meeting the needs of customers across different regions.

This PCB, with its high-performance F4BTMS220 base material, is suitable for a wide range of applications, including:

• Aerospace equipment, space and cabin equipment
• Microwave and RF systems
• Radar, especially military radar
• Feed networks
• Phase-sensitive antennas and phased array antennas
• Satellite communications, and more.

The F4BTMS series is an upgraded version of the F4BTM series. It has achieved a technological breakthrough in material formulation and manufacturing processes. Enriched with a significant amount of ceramics and reinforced with ultra-thin and ultra-fine glass fiber cloth, it shows substantial improvements in material performance and a broader range of dielectric constants. As a high-reliability material suitable for aerospace applications, it can replace similar foreign products.

By incorporating a small amount of ultra-thin and ultra-fine glass fiber cloth and a large amount of uniformly distributed special nano-ceramics mixed with polytetrafluoroethylene resin, the negative effects of glass fiber on electromagnetic wave propagation are minimized. This leads to reduced dielectric loss, enhanced dimensional stability, and decreased X/Y/Z anisotropy of the material. It also increases the usable frequency range, improves electrical strength, and enhances thermal conductivity. Additionally, the material exhibits an excellent low thermal expansion coefficient and stable dielectric temperature characteristics.

The F4BTMS series comes with RTF low roughness copper foil as a standard feature, which reduces conductor loss and provides excellent peel strength. It can be used with either copper or aluminum bases.