| MOQ: | 1pcs |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T. |
| Capacidade de abastecimento: | 5000pcs por mês |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |
| MOQ: | 1pcs |
| preço: | USD9.99-99.99 |
| Embalagem padrão: | Sacos a vácuo+caixas |
| Período de entrega: | 8-9 dias úteis |
| Método de pagamento: | T/T. |
| Capacidade de abastecimento: | 5000pcs por mês |
| Parameter | Technical Details |
|---|---|
| Base Material | IsoClad 933 (high-performance dielectric material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 155.4mm × 188mm ±0.15mm |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.3mm |
| Vias | No blind vias; via plating thickness 20 μm |
| Finished Board Thickness | 1.6mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Quality Assurance | 100% electrical testing (continuity, isolation) |