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TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board

TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board

MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo + caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 PCS por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-470.V1.0
Material Básico:
Tacônico TLX-8
Contagem de camadas:
2 camadas
Espessura da PCB:
30 mil
Tamanho da placa de circuito impresso:
40,5 mm x 70,6 mm por unidade
Máscara de solda:
Não
Serigrafia:
Não
Peso de cobre:
1 onça (equivalente a 1,4 mils) para camadas externas
Acabamento de superfície:
Imersão Ouro
Destacar:

2-layer RF PCB board

,

immersion gold RF circuit board

,

30mil laminate PCB board

Descrição do produto

This is a high-performance 2-layer rigid printed circuit board (PCB) fabricated with TLX-8 high-frequency laminate, featuring a 30mil (0.762mm) board thickness, 1oz copper weight, immersion gold surface finish, and no solder mask or silkscreen (no oil, no text). This PCB leverages TLX-8’s superior electrical and mechanical properties, making it suitable for various high-frequency applications that demand stable performance and reliable structural integrity.

 

PCB Specification

Item Specifications
Base Material TLX-8 High-Frequency Laminate
Layer Count 2 layers (double-sided PCB)
Board Dimensions 40.5mm x 70.6mm per unit, 1 piece total
Finished Board Thickness 30mil (0.762mm)
Finished Copper Weight 1 oz
Surface Finish Immersion Gold
Top/Bottom Solder Mask Not applied (no oil)
Top/Bottom Silkscreen Not applied (no text)

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm (1 oz)
- TLX-8 Substrate 30mil (0.762mm)
2 Copper Layer 2 (Outer Bottom) 35 μm (1 oz)

 

TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board 0

 

Introduction to TLX-8 Material

TLX-8 is a high-performance high-frequency laminate engineered for demanding RF, microwave, and high-speed digital applications. It exhibits excellent dielectric properties, low dissipation factor, and superior mechanical stability, making it ideal for applications that require minimal signal loss, reliable thermal performance, and consistent dimensional stability. The material is compatible with standard PCB fabrication processes, ensuring ease of manufacturing while maintaining high performance standards.

 

TLX-8 Material Properties

Properties Conditions Typical Value Unit Test Method
Dielectric Constant @ 10 GHz 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz 0.0018 - IPC-650 2.5.5.5.1
Outgassing - % TML 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.03 % ASTM E 595
Outgassing - % CVCM 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.00 % ASTM E 595
Outgassing - % WVR 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.01 % ASTM E 595
Surface Resistivity (Elevated Temp.) - 6.605 x 10⁸ Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity (Humidity Cond.) - 3.550 x 10⁶ Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Elevated Temp.) - 1.110 x 10¹⁰ Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Humidity Cond.) - 1.046 x 10¹⁰ Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Dimensional Stability (MD, After Bake) - 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (CD, After Bake) - 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (MD, Thermal Stress) - 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
Dimensional Stability (CD, Thermal Stress) - 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
Thermal Conductivity - 0.19 W/M*K ASTM F433/ASTM 1530-06
CTE (25-260 °C) - X - 21 ppm/°C IPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Y - 23 ppm/°C IPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Z - 215 ppm/°C IPC-650 2.4.41/ASTM D 3386
Td (2% Weight Loss) - 535 °C IPC-650 2.4.24.6 (TGA)
Td (5% Weight Loss) - 553 °C IPC-650 2.4.24.6 (TGA)
Peel Strength (1 oz. ED, Thermal Stress) - 2.63 (15) N/mm (Ibs/in) IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. RTF) - 2.98 (17) N/mm² (kpsi) -
Peel Strength (½ oz. ED, Elevated Temp.) - 2.45 (14) N/mm² (kpsi) IPC-650 2.4.8.3
Peel Strength (½ oz. ED, Thermal Stress) - 1.93 (11) N/mm² (kpsi) IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. rolled) - 2.28 (13) N/mm² (kpsi) -
Young’s Modulus (MD, ASTM D 902) - 6,757 (980) N/mm² (psi) ASTM D 902
Young’s Modulus (CD, ASTM D 902) - 8,274 (1,200) N/mm² (psi) ASTM D 902
Young’s Modulus (MD, ASTM D 3039) - 11,238 (1,630) N/mm² (psi) ASTM D 3039
Moisture Absorption - 0.02 % IPC-650 2.6.2.1
Dielectric Breakdown - > 45 Kv IPC-650 2.5.6
Flammability Rating - V-0 - UL-94

 

Typical Applications of TLX-8 PCB

-RF and microwave communication equipment

-High-speed digital circuits

-Test and measurement instruments

-Aerospace and defense electronic systems

-Satellite communication components

-Radar and navigation systems

-Wireless communication devices

 

Artwork, Quality Standard and Availability

Artwork for this PCB is provided in the Gerber RS-274-X format, the industry standard for PCB manufacturing, ensuring seamless compatibility with mainstream production equipment and design software. The PCB complies with recognized industry standards, guaranteeing consistent electrical performance, reliable manufacturing quality, and adherence to requirements for high-frequency applications. Furthermore, this PCB is available worldwide, catering to the needs of international customers and high-frequency circuit projects globally.

 

Conclusion

Due to its excellent dielectric properties, minimal signal loss , superior thermal stability and mechanical reliability. This TLX-8 PCB has become the optimal choice for professionals and project teams engaged in RF communication, microwave systems, high-speed digital circuits, aerospace and defense electronics, satellite communication, radar, navigation, and wireless communication sectors that demand high-performance and stable high-frequency circuit solutions.

 

TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board 1

produtos
Detalhes dos produtos
TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board
MOQ: 1 unidade
preço: USD9.99-99.99
Embalagem padrão: Sacos a vácuo + caixas
Período de entrega: 8-9 dias úteis
Método de pagamento: T/T
Capacidade de abastecimento: 5000 PCS por mês
Informações pormenorizadas
Lugar de origem
China
Marca
Bicheng
Certificação
UL, ISO9001, IATF16949
Número do modelo
BIC-470.V1.0
Material Básico:
Tacônico TLX-8
Contagem de camadas:
2 camadas
Espessura da PCB:
30 mil
Tamanho da placa de circuito impresso:
40,5 mm x 70,6 mm por unidade
Máscara de solda:
Não
Serigrafia:
Não
Peso de cobre:
1 onça (equivalente a 1,4 mils) para camadas externas
Acabamento de superfície:
Imersão Ouro
Quantidade de ordem mínima:
1 unidade
Preço:
USD9.99-99.99
Detalhes da embalagem:
Sacos a vácuo + caixas
Tempo de entrega:
8-9 dias úteis
Termos de pagamento:
T/T
Habilidade da fonte:
5000 PCS por mês
Destacar

2-layer RF PCB board

,

immersion gold RF circuit board

,

30mil laminate PCB board

Descrição do produto

This is a high-performance 2-layer rigid printed circuit board (PCB) fabricated with TLX-8 high-frequency laminate, featuring a 30mil (0.762mm) board thickness, 1oz copper weight, immersion gold surface finish, and no solder mask or silkscreen (no oil, no text). This PCB leverages TLX-8’s superior electrical and mechanical properties, making it suitable for various high-frequency applications that demand stable performance and reliable structural integrity.

 

PCB Specification

Item Specifications
Base Material TLX-8 High-Frequency Laminate
Layer Count 2 layers (double-sided PCB)
Board Dimensions 40.5mm x 70.6mm per unit, 1 piece total
Finished Board Thickness 30mil (0.762mm)
Finished Copper Weight 1 oz
Surface Finish Immersion Gold
Top/Bottom Solder Mask Not applied (no oil)
Top/Bottom Silkscreen Not applied (no text)

 

PCB Stack-up

Layer Description Thickness
1 Copper Layer 1 (Outer Top) 35 μm (1 oz)
- TLX-8 Substrate 30mil (0.762mm)
2 Copper Layer 2 (Outer Bottom) 35 μm (1 oz)

 

TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board 0

 

Introduction to TLX-8 Material

TLX-8 is a high-performance high-frequency laminate engineered for demanding RF, microwave, and high-speed digital applications. It exhibits excellent dielectric properties, low dissipation factor, and superior mechanical stability, making it ideal for applications that require minimal signal loss, reliable thermal performance, and consistent dimensional stability. The material is compatible with standard PCB fabrication processes, ensuring ease of manufacturing while maintaining high performance standards.

 

TLX-8 Material Properties

Properties Conditions Typical Value Unit Test Method
Dielectric Constant @ 10 GHz 2.55 ± 0.04 - IPC-650 2.5.5.3
Dissipation Factor @ 10 GHz 0.0018 - IPC-650 2.5.5.5.1
Outgassing - % TML 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.03 % ASTM E 595
Outgassing - % CVCM 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.00 % ASTM E 595
Outgassing - % WVR 4 H 257 °F @ ≤ 5 x 10⁻⁵ Torr 0.01 % ASTM E 595
Surface Resistivity (Elevated Temp.) - 6.605 x 10⁸ Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Surface Resistivity (Humidity Cond.) - 3.550 x 10⁶ Mohm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Elevated Temp.) - 1.110 x 10¹⁰ Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Volume Resistivity (Humidity Cond.) - 1.046 x 10¹⁰ Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1
Dimensional Stability (MD, After Bake) - 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (CD, After Bake) - 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4
Dimensional Stability (MD, Thermal Stress) - 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
Dimensional Stability (CD, Thermal Stress) - 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5
Thermal Conductivity - 0.19 W/M*K ASTM F433/ASTM 1530-06
CTE (25-260 °C) - X - 21 ppm/°C IPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Y - 23 ppm/°C IPC-650 2.4.41/ASTM D 3386
CTE (25-260 °C) - Z - 215 ppm/°C IPC-650 2.4.41/ASTM D 3386
Td (2% Weight Loss) - 535 °C IPC-650 2.4.24.6 (TGA)
Td (5% Weight Loss) - 553 °C IPC-650 2.4.24.6 (TGA)
Peel Strength (1 oz. ED, Thermal Stress) - 2.63 (15) N/mm (Ibs/in) IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. RTF) - 2.98 (17) N/mm² (kpsi) -
Peel Strength (½ oz. ED, Elevated Temp.) - 2.45 (14) N/mm² (kpsi) IPC-650 2.4.8.3
Peel Strength (½ oz. ED, Thermal Stress) - 1.93 (11) N/mm² (kpsi) IPC-650 2.4.8 Sec. 5.2.2
Peel Strength (1 oz. rolled) - 2.28 (13) N/mm² (kpsi) -
Young’s Modulus (MD, ASTM D 902) - 6,757 (980) N/mm² (psi) ASTM D 902
Young’s Modulus (CD, ASTM D 902) - 8,274 (1,200) N/mm² (psi) ASTM D 902
Young’s Modulus (MD, ASTM D 3039) - 11,238 (1,630) N/mm² (psi) ASTM D 3039
Moisture Absorption - 0.02 % IPC-650 2.6.2.1
Dielectric Breakdown - > 45 Kv IPC-650 2.5.6
Flammability Rating - V-0 - UL-94

 

Typical Applications of TLX-8 PCB

-RF and microwave communication equipment

-High-speed digital circuits

-Test and measurement instruments

-Aerospace and defense electronic systems

-Satellite communication components

-Radar and navigation systems

-Wireless communication devices

 

Artwork, Quality Standard and Availability

Artwork for this PCB is provided in the Gerber RS-274-X format, the industry standard for PCB manufacturing, ensuring seamless compatibility with mainstream production equipment and design software. The PCB complies with recognized industry standards, guaranteeing consistent electrical performance, reliable manufacturing quality, and adherence to requirements for high-frequency applications. Furthermore, this PCB is available worldwide, catering to the needs of international customers and high-frequency circuit projects globally.

 

Conclusion

Due to its excellent dielectric properties, minimal signal loss , superior thermal stability and mechanical reliability. This TLX-8 PCB has become the optimal choice for professionals and project teams engaged in RF communication, microwave systems, high-speed digital circuits, aerospace and defense electronics, satellite communication, radar, navigation, and wireless communication sectors that demand high-performance and stable high-frequency circuit solutions.

 

TLX-8 PCB Immersion Gold 2-layer 30mil Laminate RF Circuit Board 1

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