2-layer AD300D PCB 40mil Thick with EPIG Finish

This double-sided PCB utilizes AD300D as its core substrate and incorporates an EPIG (nickel-free) surface finish. Configured with 1oz (1.4 mils) copper cladding on the outer layers, a finished board thickness of 1.2mm, and 20 μm via plating, the PCB delivers consistent electrical performance and high-precision manufacturing uniformity, making it highly suitable for applications including cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas.

PCB Construction Details

PCB Stack-up

Artwork Type

The artwork provided for PCB fabrication adheres to the Gerber RS-274-X standard, the industry-accepted protocol for transmitting PCB manufacturing data.

Quality Standard

This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. The IPC-Class-2 standard establishes parameters for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications requiring consistent operation and moderate dependability.

Global Availability

This PCB is available for global supply. We provide reliable logistics and shipping services to ensure the timely delivery of products to clients across various countries and regions, with the capability to accommodate the requirements of both small-batch and large-volume orders.

Introduction to AD300D Base Material

AD300D laminates are ceramic-filled, glass-reinforced PTFE-based materials engineered to offer a controlled dielectric constant, low loss performance, and excellent passive intermodulation (PIM) performance. Manufactured to meet the demands of today’s wireless antenna markets, this PTFE resin-based material is compatible with standard PTFE fabrication processes and provides a cost-effective construction that enhances both electrical and mechanical performance.

Key Features of AD300D

Benefits

• Low loss tangent (<0.002 at 10 GHz)
• Excellent circuit performance in all typical wireless frequency bands
• Controlled dielectric constant (±0.05) for repeatable circuit performance
• Very low PIM (-159 dBc at 30 mil, 1900 MHz), ensuring excellent antenna performance and reduced yield loss due to PIM-related issues
• Excellent dimensional stability, enabling repeatable circuit performance and improved manufacturing yields

Typical Applications

• Cellular infrastructure base station antenna
• Automotive telematics antenna Systems
• Commercial satellite radio antenna

Conclusion

This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of cellular infrastructure base station antennas, automotive telematics antenna systems, and commercial satellite radio antennas. Leveraging the high-performance AD300D substrate, this PCB serves as a reliable and high-quality solution for high-demand wireless applications requiring stable electrical performance, low loss, and excellent PIM performance.