logo
Casa ProdutosPlaca do PWB do RF

Double-layer Taconic TLY-3 PCB 20mil Laminate

Certificado
CHINA Bicheng Electronics Technology Co., Ltd Certificações
CHINA Bicheng Electronics Technology Co., Ltd Certificações
Revisões do cliente
Kevin, Recebeu e testou as placas - agradecimentos muito. Estes são perfeitos, exatamente o que nós precisamos. rgds Ricos

—— Rich Rickett

Ruth, Eu obtive o PWB hoje, e são apenas perfeitos. Ficar por favor pouca paciência, minha ordem seguinte está vindo logo. Cordialmente de Hamburgo Olaf

—— Olaf Kühnhold

Olá! Natalie. Era perfeito, mim une algumas imagens para sua referência. E eu envio-lhe 2 projetos seguintes incluir no orçamento. Agradecimentos muito outra vez

—— Sebastian Toplisek

Kevin, Agradecimentos, foram feitos perfeitamente, e trabalham bem. Porque prometidas, são aqui as relações para meu projeto mais atrasado, usando o PCBs que você fabricou para mim: Cordialmente Daniel

—— Daniel Ford

Estou Chat Online Agora

Double-layer Taconic TLY-3 PCB 20mil Laminate

Double-layer Taconic TLY-3 PCB 20mil Laminate
Double-layer Taconic TLY-3 PCB 20mil Laminate

Imagem Grande :  Double-layer Taconic TLY-3 PCB 20mil Laminate

Detalhes do produto:
Lugar de origem: CHINA
Marca: Bicheng
Certificação: UL, ISO9001, IATF16949
Número do modelo: BIC-052.V1.0
Condições de Pagamento e Envio:
Quantidade de ordem mínima: 1pcs
Preço: USD9.99-99.99
Detalhes da embalagem: Sacos a vácuo+caixas
Tempo de entrega: 8-9 dias úteis
Termos de pagamento: T/T.
Habilidade da fonte: 5000pcs por mês

Double-layer Taconic TLY-3 PCB 20mil Laminate

descrição
Material base: Tacônico TLY-3 Contagem de camadas: 2 camadas
Espessura da PCB: 0,6 mm Tamanho da PCB: 125 mm x 47 mm (±0,15 mm)
Peso de cobre: 1 onça (1,4 mils) nas camadas externas Acabamento superficial: Placa de prata / placa de ouro (ouro sobre prata)
Destacar:

Double-layer RF PCB board

,

Taconic TLY-3 PCB laminate

,

20mil RF PCB board

Double-layer Taconic TLY-3 PCB 20mil Laminate

This 2-layer rigid PCB is built around Taconic TLY-3, a high-performance laminate featuring lightweight woven fiberglass. Renowned for exceptional dimensional stability, ultra-low dissipation factor, and consistent dielectric properties, TLY-3 makes this PCB a standout choice for demanding applications—from automotive radar (77 GHz) to satellite communications and aerospace systems.

 

1. PCB Specifications

Parameter Specification
Base Material Taconic TLY-3 (woven fiberglass-reinforced PTFE)
Layer Count 2-layer (no blind vias)
Board Dimensions 125mm x 47mm (±0.15mm)
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Finished Board Thickness 0.6mm
Finished Copper Weight 1oz (35μm per outer layer)
Via Plating Thickness 20μm
Surface Finish Silver plate with gold over silver
Silkscreen (Top/Bottom) No / No
Solder Mask (Top/Bottom) No / No
Quality Testing 100% electrical test pre-shipment

 

2. PCB Stack-up

Layer/Component Specification
Copper Layer 1 35μm (1oz)
Taconic TLY-3 Core 20mil (0.508mm)
Copper Layer 2 35μm (1oz)

 

3. Artwork Format, Quality Standards & Availability

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Global Availability: Supplied worldwide

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 0

 

4. TLY-3 Material: Overview & Key Features

Taconic TLY-3 is a woven fiberglass-reinforced PTFE laminate engineered to address the most demanding high-frequency and high-reliability requirements. Unlike chopped fiber PTFE composites, its woven matrix delivers superior dimensional stability—making it ideal for high-volume manufacturing (where consistency reduces waste and boosts yields).

 

A key advantage of TLY-3 is its performance at millimeter-wave frequencies: OEM testing at 77 GHz (critical for automotive radar) shows it matches the insertion loss and dielectric properties of competing chopped fiber materials, while delivering higher manufacturing yields (a major cost-saving benefit).

 

Below are TLY-3’s critical technical features (measured at 10 GHz unless noted):

Feature Specification
Dielectric Constant (Dk) 2.33 ± 0.02 (uniform and consistent)
Dissipation Factor (Df) 0.0012 (ultra-low for minimal signal loss)
Thermal Conductivity 0.22 W/mK (unclad, efficient heat transfer)
CTE (x/y/z) 26 ppm/°C / 15 ppm/°C / 217 ppm/°C
Peel Strength (1oz Cu) 17 lbs/in (strong bond between copper and substrate)
Moisture Absorption 0.02% (near-zero, preventing performance degradation from humidity)
Flammability Rating UL 94 V-0 (flame-retardant, safe for automotive/aerospace use)
Outgassing (TML/CVCM/WVR) 0.01% / 0.01% / 0.01% (meets strict aerospace outgassing requirements)
Laser Ablatability Yes (enables precise, high-resolution fabrication for complex designs)

 

5. Core Benefits of the TLY-3 PCB

This PCB leverages TLY-3’s inherent advantages to solve key challenges in high-frequency and high-reliability applications:

 

Superior Dimensional Stability: Woven fiberglass matrix eliminates warpage or shrinkage during manufacturing, boosting yields and ensuring consistent fit in assemblies.

 

Ultra-Low Dissipation Factor (0.0012): Minimizes signal loss at high frequencies (e.g., 77 GHz automotive radar, Ka-band satellite communications), preserving data integrity.

 

Consistent Dielectric Constant (±0.02): Ensures predictable signal behavior across the PCB, critical for precision components like filters and couplers.

 

High Peel Strength (17 lbs/in for 1oz Cu): Reinforces the bond between copper layers and the TLY-3 core, preventing delamination under thermal stress (e.g., automotive temperature cycles).

 

Near-Zero Moisture Absorption (0.02%): Protects performance in humid environments (e.g., aerospace or outdoor telecommunications), avoiding dielectric breakdown or signal degradation.

 

Laser Ablatability: Enables high-precision fabrication of fine features, supporting miniaturized designs for space-constrained applications.

 

6. Typical Applications

Automotive Radar: Optimized for 77 GHz systems (adaptive cruise control, collision avoidance), with low signal loss and dimensional stability to withstand automotive temperature cycles.

 

Satellite/Cellular Communications: Performs reliably in Ka, E, and W band frequencies, supporting high-speed data transfer for satellite links and 5G/6G infrastructure.

 

Aerospace & Avionics: Meets strict outgassing and flame-retardant standards (UL 94 V-0), suitable for in-cabin electronics and radar systems.

 

High-Frequency Amplifiers & Receivers: Ideal for Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs), where low Df preserves signal quality.

 

Precision Passive Components: Supports filters, couplers, and phase shifters, thanks to TLY-3’s consistent Dk and low moisture absorption.

 

Conclusion

This 2-layer PCB with Taconic TLY-3 material represents a perfect blend of precision, performance, and reliability. Its tight manufacturing tolerances (e.g., ±0.15mm dimensions, 4/6 mil trace/space), industry-standard quality (IPC-Class-2), and TLY-3’s ultra-low Df and dimensional stability make it a trusted solution for high-frequency and high-reliability applications.

 

Double-layer Taconic TLY-3 PCB 20mil Laminate 1

Contacto
Bicheng Electronics Technology Co., Ltd

Pessoa de Contato: Ms. Ivy Deng

Telefone: 86-755-27374946

Fax: 86-755-27374848

Envie sua pergunta diretamente para nós (0 / 3000)

Outros Produtos